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Parallel Microassembly with Electrostatic Force Fields Karl-Friedrich Bohringer, Ken Goldberg, Michael Cohn, Roger Howe, Al Pisano University of California, Berkeley http://www.ieor.berkeley.edu/~karl/MicroSelfAssembly
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Document Date: 2003-07-05 01:01:00


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File Size: 322,61 KB

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City

San Francisco / Wellesley / Minneapolis / Stockholm / Tokyo / Leuven / Albuquerque / Pittsburgh / Heitsching / Nagoya / Grenoble / Oiso / San Jose / /

Company

Sony / Vf / Micro Electro Mechanical Systems / Micromachine Technologies / /

Country

Germany / Sweden / Belgium / France / Japan / United States / /

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Facility

Etcheverry Hall / Cory Hall / Al Pisano University of California / B Etcheverry Hall / /

IndustryTerm

vibratory devices / device technology / microrobotics assembly systems / Flip-chip technology / electro mechanical systems / energy / wireless transceivers / self-assembling systems / e.g. electronics / chemical strategy / chemical kinetics / electrical networks / industrial products / ip-chip technology / possible hybrid devices / /

NaturalFeature

Surface-mount / /

Organization

National Science Foundation / UC Berkeley / University of California / Berkeley / US Federal Reserve / National Aeronautics and Space Administration / Stanford / /

Person

John Canny / Michael Cohn / Ken Goldberg / Bruce Donald / Roger Howe / D. A. Borkholder / V / Lydia Kavraki / Wojciech Matusik / Kris Pister / /

Position

Vp base Figure / Hilton Head / Author addresses / piezo Vp / /

ProvinceOrState

Minnesota / New Mexico / Pennsylvania / California / Massachusetts / /

PublishedMedium

Applied Physics Letters / /

Technology

semiconductor / MEMS technology / underlying device technology / photolithography / integrated circuits / laser / Microelectromechanical Systems / VLSI technology / lasers / dielectric / Flip-chip technology / Simulation / ip-chip technology / /

URL

www.ieor.berkeley.edu / http /

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