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Manufacturing / Electromagnetism / Electronics manufacturing / Electrical engineering / Stationery / Surface-mount technology / Epoxy / Membrane switch / Conductive ink / Packaging materials / Adhesives / Technology


P R O D U C T I O N Surface Mount 101: Processing and Design Considerations for Membrane Switches Choosing a Manufacturing Process
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Document Date: 2011-09-29 19:09:08


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File Size: 3,03 MB

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City

Warminster / Providence / Toronto / Needle / /

Company

EFD Inc. / Nicomatic North America / /

Country

Canada / /

Currency

USD / /

Facility

station Flood / station Capital / station Process / /

IndustryTerm

to offer value added products / metal / stencil printing process / built-in software / side chemical reaction / gas-fired burner / screen printing / circuit manufacturing / metal sheet / membrane switch manufacturing / printing / distinct manufacturing processes / Printing vs. / metal pallet / thermocouple hardware / repeatable manufacturing process / uses technology / gantry systems / printing process / stencil printing / silver ink printing / membrane switch applications / metal needle tip / manufacturing stances / Pressure pump dispensing technology / dual cure product / component adhesive technology / high volume manufacturing / pick-andplace equipment / higher volume applications / manufacturing / surface mount equipment / surface mount processing / stencil printing station / metal solder / surface mount applications / thin metal sheet / manufacturing processes / stencil printing equipment ranges / energy / pick-and-place equipment / /

NaturalFeature

Surface Mount / /

Organization

US Federal Reserve / /

Person

Dave Fisher / Mike Streun / Don Banfield / Conductive Compounds Vi / /

Position

author / Product Manager and Co-Founder / Positive Displacement vs. Pressure Pumps Forward / switch designer / /

Technology

radiation / laser / 4 Chip / Pressure pump dispensing technology / uses technology / dielectric / component adhesive technology / /

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