Thermal Analysis and its application to High Power GaN HEMT Amplifiers A. Prejs, S. Wood, R. Pengelly, W. Pribble Cree Inc., Durham, NC[removed]USA Abstract – A systematic and consistent approach to the thermal modeling - USA Inc. - Document - PDFSEARCH.IO

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	Thermal Analysis and its application to High Power GaN HEMT Amplifiers A. Prejs, S. Wood, R. Pengelly, W. Pribble Cree Inc., Durham, NC[removed]USA Abstract – A systematic and consistent approach to the thermal modeling Add to Reading List Document Date: 2014-05-08 11:30:56 Open Document File Size: 494,98 KB Share Result on Facebook City Durham / / Company W. Pribble Cree Inc. / Cree / Ansys / performed using Ansys / / / Facility J. Garret / / IndustryTerm metal / transistor applications / electronic devices / transistor technologies / carrier amplifier / thermal energy / semiconductor technologies / imaging / semiconductor devices / metal layers / / Person David P. Dewitt / Frank P. Incropera / / ProvinceOrState North Carolina / Pennsylvania / / Technology spectroscopy / Microwave / heat transfer / semiconductor technologies / transistor technologies / simulation / CDMA / semiconductor devices / CAD / / SocialTag Heat transfer Electronic engineering Transistor Gallium nitride Thermal resistance Heat sink Thermal conductivity Power semiconductor device Gain compression Chemistry

Thermal Analysis and its application to High Power GaN HEMT Amplifiers A. Prejs, S. Wood, R. Pengelly, W. Pribble Cree Inc., Durham, NC[removed]USA Abstract – A systematic and consistent approach to the thermal modeling Add to Reading List