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Electronic engineering / Probe card / Flip chip / Microelectromechanical systems / Reliability / Solder / Wafer testing / Bead probe technology / Millipede memory / Semiconductor device fabrication / Technology / Materials science


Reliable testing of Cu pillar technology for smart devices By Amer Cassier, Lily Zhao, Ahmer Syed, Steve Bezuk, William Miller [Qualcomm] and Amy Leong, Mike Slessor [FormFactor Inc.] T
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Document Date: 2014-09-30 21:12:39


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File Size: 1,29 MB

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