![Design / Telecommunications engineering / Very-large-scale integration / Three-dimensional integrated circuit / International Conference on Computer-Aided Design / Design for manufacturability / International Symposium on Physical Design / Multiple patterning / Electric / Electronic engineering / Electronics / Integrated circuits Design / Telecommunications engineering / Very-large-scale integration / Three-dimensional integrated circuit / International Conference on Computer-Aided Design / Design for manufacturability / International Symposium on Physical Design / Multiple patterning / Electric / Electronic engineering / Electronics / Integrated circuits](https://www.pdfsearch.io/img/74410616fef2f89fc54bb4bb301f12e9.jpg) Date: 2015-01-31 02:10:36Design Telecommunications engineering Very-large-scale integration Three-dimensional integrated circuit International Conference on Computer-Aided Design Design for manufacturability International Symposium on Physical Design Multiple patterning Electric Electronic engineering Electronics Integrated circuits | | Graduate Seminar Design for Manufacturability and Reliability in Extreme Scaling and Beyond ECE Seminar CommitteeAdd to Reading ListSource URL: www.ece.cmu.eduDownload Document from Source Website File Size: 171,18 KBShare Document on Facebook
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