| Document Date: 2015-04-07 07:58:50
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City Berlin / / Company Ball / IZM System Integration & Interconnection Technologies / EMC / Fraunhofer IZM / Fraunhofer IZM Press / Power Electronic Systems / Package (SiP) Electronics / Interconnection Technologies / Microperipheric Technologies / Altium / / / Facility Technical University of Berlin / Interconnection Technologies The Fraunhofer Institute / / / IndustryTerm materials electronics / direct imaging system / prototype manufacturing / measurement technology / active chips / encapsulation technology / plasmonic systems / integration lead frame devices / microfluidic applications / communication technologies / frequency applications / technology transfer discharge / sensor technology / power electronics / fluxless flip-chip / temperature resistant systems / cloud-based health services / electronic systems / wireless interfaces / stretchable electronic systems / submounts embedding technology / textile-integrated electronic systems / energy / medical technology / e.g. gas / technology areas / Wireless sensors / spectroscopic systems / printing / integrated systems products / research integration technologies / material processing / converter applications / power management / chip-on-board processing / cyber-physical systems / stencil printing / flip-chip / individual applications / automatic industrial applications / electronics / data pre-processing / techniques / individual solutions / nanostructure technology / energy efficiency / energy cells / photonic packaging technology transfer / system concepts / assembly systems / intelligent electronics / substrate manufacturing / / Organization Center for Microperipheric Technologies / Fraunhofer Institute for Reliability / Technical University of Berlin / / Person Volker Mai / Erik Müller / Christine Kallmayer / Simplorer / Tolga Tekin / Stefan Schmitz / Andreas Ostmann / Karl-Friedrich Becker / Henning Schröder / / / Position COB / technology and reliability Head / Designer / / ProvinceOrState Connecticut / / Technology Christine Kallmayer ing technologies / biosensors / Photonic integration technologies / X-ray / sensor technology / Working groups Wirebonded chip stack Chip / Medical Microsystems Medical technology / ultrasound / Microwave / microfluidics / optical fiber / encapsulation technology / ion exchange / laser / Fine-pitch flip-chip / communication technologies / nanostructure technology / MEMS / development technologies / semiconductors / standardized protocol / submounts embedding technology / Optical measurement technology / cell phones / simulation / fluxless flip-chip / We research integration technologies / embedding technology / ICA flip-chip / / URL http /
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F R A U N H O F E R I N S T I T U T E F O R R e l ia b i l it y an d M i c roin T e g ration I Z M Department System Integration and Interconnection Technologies