San Francisco / Piscataway / Kyoto / Helsinki / Tempe / Bangalore / Teddington / Phoenix / Aachen / Tsukuba / Munich / Sao Paulo / Orlando / New York / Beijing / San Diego / San Jose / /
Company
Electronics Engineers Inc. / International Microsystems / James Morris Energy Electronics / IEEE CPMT Symposium Japan / IEEE CPMT Society Newsletter 1 CPMT Officers / IEEE Fellows / Electrotechnical Laboratory / Debendra Mallik Intel Corporation / 3D Integration System Group / ABM / National Physical Laboratory / Motorola / Facebook / Craig Gaw Green Electronics / Wiren Becker IBM Corporation / Freescale Semiconductor / Okmetic / International Technology Roadmap / CPMT Transactions / High Density Interconnection Group / Advanced Packaging Technologies / RF & Thz Technologies / Jie Xue Cisco Systems Inc / Texas Instruments Incorporated / AT&T Bell Laboratories / Electronics Manufacturing / Corporate Quality Network Intel Corporation / Edwards’ Enterprise Consulting LLC / Qualcomm / Intel / CPMT Society Newsletter / Yong Liu Fairchild Semiconductor Corp. / Redistributed Chip Packaging Technology / Distinguished Lecturers / /
Country
Brazil / United Kingdom / China / Finland / Netherlands / Japan / India / Taiwan / Germany / United States / /
Currency
USD / AMD / / /
Event
Reorganization / Product Issues / Person Travel / /
Facility
Stanford University / University of Illinois / Tsinghua University / National Institute of Advanced Industrial Science / Manufacturing Technology Society UFABC Student Chapter Federal University of ABC Abstract / Pennsylvania State University / Nagoya Institute of Technology / Purdue University / International Center / Arizona State University / *Aalto University / Chinese University of Hong Kong / International Airport of Guarulhos / Joint Research Centre of European Commission / Helsinki University of Technology / Nanoelectronics Research Institute / Microelectronics Institute of Tsinghua University / Weileun Fang National Tsing Hua University / Lamar University / Federal University of ABC / Electronic Packaging R&D Center of Microelectronics IEEE CPMT UFABC Student Branch Chapter Celebrates One-Year Anniversary Raquel Paulucci / Aalto University / Institute of Electrical / Cornell University / University of Maryland / Fudan University / Japan Institute of Electronics Packaging / University of Art / Institute of Electrical Engineers / Institute of Electronics Information / / /
Holiday
New Year's Day / /
IndustryTerm
technology innovation / interconnect technologies / electrical and electronic technology / micro-electromechanical systems / material solutions / manufacturing perspectives / microelectronic packaging technology / device technologies / based wafer manufacturing / wire bonding technologies / technology transfer / materials and packaging technologies / semiconductor devices / elite global / electronic packaging technology / thermal management / micro-electro-mechanical systems / collaboration tool / manufacturing experiences / electronics / electronic manufacturing / optoelectronic systems / process technologies / semiconductor technology / electrical/electronic connector technology / high volume manufacturing / assembly packaging services / technology areas / potential applications / thinner and lighter devices / technology changes / interconnection technology / manufacturing / film technology / flip chip interconnection technology / radar systems / manufacturing technologies / opto-electronic sampling measurement technology / manufacturing technology / disruptive technologies / electronic products / chip stacking technology / electronic manufacturing service / speed signal measurement technology / research / automotive products / micro-via technology / developing revolutionary materials and packaging technologies / /
MusicGroup
Ph.D. / /
Organization
University of Maryland / Chinese University of Hong Kong / Japan Society of Applied Physics / Nanoelectronics Research Institute / CPMT UFABC Student Chapter / Helsinki School of Economics / CPMT Society / Student Branch Chapter / Distinguished University / Manufacturing Technology Society UFABC Student Chapter Federal University of ABC Abstract / Cornell University / Electronic Packaging R&D Center / Helsinki University of Technology / Joint Research Centre / University of Art and Design / Manufacturing Technology Society / Board of Governors Member-at-Large / Nagoya Institute of Technology / Nagoya / Components / Packaging / and Manufacturing Technology Society / Federal University of ABC / CPMT / SEMI / International Association of Students / GT Institute / CPMT Student Branch Chapter / ECTC Executive Committee / American Society of Mechanical Engineers / Institute of Electrical / Society of Photo-Optical Instrumentation Engineers / Aalto University / National Academy of Engineering of the USA / National Institute of Advanced Industrial Science / Microelectronics Institute / Institute of Electronics Information and Communication Engineers / Honorary / ASME / Finnish Academy of Technical Sciences / Purdue University / Aalto University* School of Electrical Engineering / Department of Mechanical Engineering / the Pennsylvania State University / University of Illinois / Tsinghua University Student Branch Chapter / Semiconductor Industry Association / CPMT Student Chapter / Charles Smithgall Institute / Fudan University / Shanghai / Board of Governors / Weileun Fang National Tsing Hua University / IEEE ED/CPMT Shanghai Chapter / IEEE CMPT Japan Chapter / Lamar University / CSP Sub-committee / Packaging Society / IEEE CPMT UFABC Student Chapter / Institution of Engineering and Technology / European Commission / ECTC Advanced Packaging Sub-committee / Institute of Electrical and Electronics Engineers / Tsinghua University / International Microelectronics and Packaging Society / IEEE CPMT Society / Institute of Electrical Engineers of Japan / SRC GRC Interconnect and Packaging Sciences’ Science Area Coordinating Committee / Department of Electrical Engineering and Automation / Brazilian Association of Metallurgy / Materials and Mining / IEEE UFABC Student Branch / Arizona State University / Society of Manufacturing Engineers / Student Chapter / Stanford University / Fellow Evaluation Committee / Japan Institute of Electronics Packaging / /
Person
Paul A. Totta / Everaldo Carlos Venancio / Nihal Sinnadurai / Paul Wesling / José E. Schutt-Ainé Lecturers / Badih El-Kareh / Thomas G. Reynolds III / James E. Morris / Sydney Santos / George A. Katopis / Yutaka Tsukada / Henry Taube / Xuejun Fan / E. Jan Vardaman / Bill Bottoms / Beth Keser / Albert F. Puttlitz / Rajen Chanchani / Philip Garrou / S.W. Ricky Lee / Gustavo Nogueira Nunes / George G. Harman / Michael Lebby / Ralph W. Wyndrum / Nasser Bozorg-Grayeli / Masahiro Aoyagi / Rao Tummala / Bill Chen / Kyung W. Paik / Karl J. Puttlitz / Guilherme Lima / Luiz Fernando Setz / Steven Bezuk Chris Bailey / Patrick Thompson / Chin C. Lee / Isabela Cordeiro / Humbeto Yoshimura / Horacídio Leal Filho / Kwang-Lung Lin / Yu-Long Jiang / T. Paul Parker / Gerson Luiz Mantovani / William T. Chen / John W. Balde / Tamara Costa / Toni Mattila / Dongkai Shangguan / Charles W. Lee / Ning-Cheng Lee / Phil Garrou / Rao R. Tummala / W. Ricky Lee Marsha Tickman / Waldir Filho / Rodrigo Kenji / H. Anthony Chan / Danilo Carastan / Paul D. Franzon / Avram Bar-Cohen / Ravi Todi / Gabriela Favaron / Wayne Johnson Jean Trewhella Thomas / Noor Ain Kamsani / Yong-Khim Swee / Herbert Reichl / P. Wong / Mauro J Walker / Barbara Souza / Kelly Matias / Karl Puttlitz Sr. / Jorge Costa / Jeffrey C. Suhling / Li Li / Nasser Bozorg-Grayeli Receives / C. Lee High Density Substrates / Bahgat Sammakia / Tony Mak / Cheng Lee / Cristine Costa Fulchini / Jean-Marc Rollin / Michael Pecht / Brian Smith / Gilles Poupon / Renata Ayres / Erik Jung Circulate / Walter Trybula / Tamara Santos / R. Wayne Johnson / John H Lau / Horacídio Leal Barbosa Filho / Ephraim Suhir / Douglas Hopkins / Johan Liu / John H. Lau / Raquel Paulucci / Jean Trewhella / Kitty Pearsall / Hirofumi Nakajima / / /
Position
Advisor / Executive Director / Director KwangLung Lin Programs / lead technologist and manager of the Redistributed Chip Packaging Technology / DARPA Program Manager / director for industry engagement / CEO / Vice General Chair / Professor / engineer / scientist / Managing Editor / representative / Student Branch Chapters Co-Editor / founding chair / PhD Thesis Advisor / program director / team leader of Opto-Electronic System Integration Collaborative Research Team / Technology Manager / manager / Program Chair / Chair International WLP Conference WLP Track / vice-coordinator / Editor-in-Chief / technical executive / or originator / Vice President of Technology and Manufacturing and Director / Director Package Development / President / group leader / Senior Technical Advisor / communications director / student chapter chair / Major / general chair / VP / present Materials Engineering coordinator / IMAPS Device Packaging Conference Technical Chair / Assistant Program Chair / researcher / Students Programs Director / Student Branch Chapters list Co-Editor / Student Branch Counselor / deputy director / director / local president / chair / Co-Editor / leader in the development / Senior Technical Advisor of ASM / Counselor / member / lead technologist and manager / rickylee@ieee.org kitty.pearsall@gmail.com Program Director / /
Product
International 3D System / materials / /
ProgrammingLanguage
ABC / /
ProvinceOrState
California / Arizona / New Jersey / Illinois / New York / Maryland / /
Region
Northern Canada / Eastern North Carolina / /
SportsLeague
International Association / Stanford University / /
Technology
flip chip interconnection technology / opto-electronic sampling measurement technology / electrical and electronic technology / optoelectronics / wire bonding technologies / WL-CSP technology / electrical/electronic connector technology / semiconductor / interconnection technology / microwave / electronic packaging technology / device technologies / PDF / 2015 Technology / http / Simulation / heat transfer / html / integrated circuits / MEMS / tantalum film technology / micro-via technology / semiconductor technology / semiconductor devices / Smart Phones / 3D LSI chip / fundamental 3D LSI chip stacking technology / 2 packaging technologies / microelectronic packaging technology / high speed signal measurement technology / process technologies / /
Components, Packaging, and Manufacturing Technology Society Newsletter THE GLOBAL SOCIETY FOR MICROELECTRONICS SYSTEMS PACKAGING cpmt.ieee.org