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Electronics manufacturing / Metallurgy / Tin / Allotropy / Solder / Tin pest / Restriction of Hazardous Substances Directive / Bismuth / Alloy / Chemistry / Matter / Chemical elements


Technical brief Tin pest in lead-free solders
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Document Date: 2012-02-16 09:36:46

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File Size: 189,72 KB

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City

London / /

Company

MCB University Press / /

Facility

The Open University / /

IndustryTerm

electronics industry / surface mount technology / transformation product / /

Organization

UK William J. Plumbridge Materials Engineering Department / UK Colin Gagg Materials Engineering Department / Open University / Yoshiharu Kariya Materials Engineering Department / /

Person

Edward Arnold / Milton Keynes / Colin Gagg / Yoshiharu Kariya / /

Technology

surface mount technology / /

URL

http /

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