EDS Meetings 21_Jun_2012-1

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Date: 2012-08-02 15:22:54 Engineering Electronic engineering Professional associations Semiconductors IEEE Electron Devices Society IEEE Standards Association Jacek M. Zurada IEEE Reliability Society International Electron Devices Meeting Institute of Electrical and Electronics Engineers Standards organizations International nongovernmental organizations		EDS Meetings 21_Jun_2012-1 Add to Reading List Source URL: eds.ieee.org Download Document from Source Website File Size: 3,36 MB Share Document on Facebook

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	Simulation Tool for IGBT modules R. Schnell ABB Switzerland Ltd, Semiconductors, Fabrikstrasse 3, CH – 5600 Lenzburg, Switzerland e-mail: Abstract: ABB has recently released a new simulation DocID: 1vk86 - View Document
	Reducing Gate-Driven Leakage in 2D Semiconductors: Two-dimensional materials such as graphene and MoS2 have a wide range of bandgaps and effective masses, making them suitable for many different applications including m DocID: 1vg3M - View Document
	The Toyota Riken International Workshop Organic Semiconductors, Conductors, and Electronics 　October 24, Wednesday　Octeber 25, Thursday 9:00 Hisao Ishii DocID: 1vehL - View Document
	ABB Semiconductors AG Soft Punch Through (SPT) Soft Punch Through (SPT) – Setting new Standards in 1200V IGBT S. Dewar, S. Linder, C. von Arx, A. Mukhitinov, G. Debled DocID: 1vaF8 - View Document