Journal of Undergraduate Research 4, Selective Atomic Layer Deposition (SALD) of Titanium Dioxide on Silicon and Copper Patterned Substrates K. Overhage Department of Chemical Engineering, Purdue University, I

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Date: 2011-03-09 12:29:52 Semiconductor device fabrication Chemistry Matter Manufacturing Thin film deposition Atomic layer deposition Titanium dioxide Chemical vapor deposition Diffusion barrier Thin film Titanium nitride Crystalline silicon		Journal of Undergraduate Research 4, Selective Atomic Layer Deposition (SALD) of Titanium Dioxide on Silicon and Copper Patterned Substrates K. Overhage Department of Chemical Engineering, Purdue University, I Add to Reading List Source URL: jur.phy.uic.edu Download Document from Source Website File Size: 454,10 KB Share Document on Facebook

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