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Semiconductor device fabrication / Heat transfer / Heat conduction / Integrated circuits / Passive fire protection / Three-dimensional integrated circuit / Heat sink / Thermal conductivity / Back end of line / Chemical engineering / Mechanical engineering / Electronic engineering


Document Date: 2012-02-03 19:45:42

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File Size: 1,92 MB

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Santa Clara / Rome / San Jose / /

Company

Diodes / Elsevier Ltd. / Ball Grid Array Metal / CRC Press / Belgium Gradient Design Automation Inc. / Gradient Design Automation Inc. / /

Country

United States / Italy / /

Currency

USD / /

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IndustryTerm

metal / metal layer / thermal simulation tool / low power applications / 3DIC chip / thermal simulation tools / structure metal / metal meander resistors / low power devices / layout design tool / test chips / test chip / metal layers / electronic systems / higher level simulation tool / thermal networks / dedicated thermal test chip / thermal test chip / /

OperatingSystem

Linux / /

Person

Noella Howard / M. Rencz / V / Enrico A. Garcia / H. Oprins / V / Cadence VirtuosoTM / /

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Position

Introduction General / Corresponding author / /

ProgrammingLanguage

RC / /

ProvinceOrState

California / /

Technology

3DIC chip / chip design / Linux / dedicated thermal test chip / Heat transfer / Key technologies / simulation / ICs Experimental validation Thermal test chip / test chips / test chip / integrated circuit / thermal test chip / /

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http /

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