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Semiconductor device fabrication / Heat transfer / Heat conduction / Integrated circuits / Passive fire protection / Three-dimensional integrated circuit / Heat sink / Thermal conductivity / Back end of line / Chemical engineering / Mechanical engineering / Electronic engineering
Date: 2012-02-03 19:45:42
Semiconductor device fabrication
Heat transfer
Heat conduction
Integrated circuits
Passive fire protection
Three-dimensional integrated circuit
Heat sink
Thermal conductivity
Back end of line
Chemical engineering
Mechanical engineering
Electronic engineering

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