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Heat conduction / Heat transfer / Semiconductor device fabrication / Passive fire protection / Electronics manufacturing / Three-dimensional integrated circuit / Heat sink / Thermal conductivity / Back end of line / Chemistry / Chemical engineering / Electronic engineering


Document Date: 2010-04-29 14:20:31

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City

Leuven / Santa Clara / Rome / San Jose / /

Company

EDA Publishing / CRC Press / Belgium Gradient Design Automation Inc. / Gradient Design Automation Inc / /

Continent

Asia / /

Country

Belgium / United States / Italy / /

IndustryTerm

metal / metal layer / simulation tool / metal bump / 3DIC chip / structure metal / metal meander resistors / low power devices / layout design tool / metal thermal behavior / metal layers / electronic systems / thermal networks / /

OperatingSystem

Linux / /

Organization

SEMI / /

Person

Cadence Virtuoso Cadence Virtuoso / Cadence Virtuoso / Noella Howard / M. Rencz / V / C. Torregiani / V / Enrico A. Garcia / Cadence VirtuosoTM / Cadence Virtuoso Techonology Files Heaters / /

Position

INTRODUCTION General / /

ProgrammingLanguage

AWK / RC / /

ProvinceOrState

California / /

Technology

3DIC chip / chip design / semiconductors / Linux / heat transfer / Key technologies / simulation / /

URL

http /

SocialTag