Binghamton / Nashville / Roseville / London / Piscataway / Dresden / Portland / New York / San Diego / San Jose / /
Company
Extreme Environment Electronics / Packaging Roadmap Technical Working Group / Sperry / Texas Instruments / ASE Group / IEEE CPMT Symposium Japan / Nokia / Materials Chemistry / Kyocera / Delphi / Renesas Electronics Co. / NEC Electronics Inc. / Center for Advanced Vehicle / IEEE CPMT Society Newsletter / IEEE Transactions / CPMT Finland / Manufacturing Technology Society Newsletter / CPMT Chapter / RCA / ECTC / Interconnection / MEMS / Cisco Systems Inc. / CPMT Transactions / Cisco Distinguished / Jie Xue Cisco Systems Inc / Electronics Manufacturing / NEC Co. / Qualcomm / Intel / Unisys / Electronics Engineers Inc. / James Morris Energy Electronics / Flip Chip Technologies / IBM Distinguished / IBM Kitty / TSV / CPMT Society / IBM Corporation / IEEE CPMT Society Newsletter 1 CPMT Officers / ASE Inc / R. Wayne Johnson / Tellabs / Philips Electronics / Packaging Technologies / IEEE Press / ASME / Application-Optimized Systems / NEC Corp. / HDP User Group International Inc. / Soldering / Motorola / Invest / McGraw-Hill / Emerging Technologies / Electronics Packaging Manufacturing / Murata Electronics N.A. Inc. / Wright Patterson Air Force Base Materials Laboratory / Components / Bell Labs / AMI Semiconductors / Indium Corporation of America / Renesas Technology / ESTC / TAB / EMAP / Surface Mount Technology / Winter 2014 / Distinguished Lecturers / /
Continent
Europe / /
Country
Finland / Japan / Canada / United States / United Kingdom / China / Taiwan / New Zealand / Singapore / /
Currency
USD / / /
Event
Employment Change / Reorganization / M&A / /
Facility
Union College / University of Bordeaux / Binghamton’s Institute / National Taiwan University / University of Illinois / Vanderbilt University / North West Florida State College / University of Akron / University of California / University of Missouri-Rolla / Mechanical Engineering University of Maryland / Auburn University / University of Texas Austin / Victoria University of Wellington / Shinshu University / University of Canterbury / Portland State University / Open University / College Park / Helsinki University of Technology / Columbia University / Institute of Materials Research / University of Wisconsin / Dresden University of Technology / University of Virginia / Carnegie Mellon University / University of Pittsburgh / Institute of Electrical / University of Maryland / College of Engineering Senior Research Award / Shanghai Jiao Tong University / University of Saskatchewan / Pennsylvania State University / Chalmers University of Technology / National Cheng Kung University / University of London / University of Greenwich / College of Engineering Birdsong Superior Teaching Award / University of Auckland / Institute of Micro-Nano Technology / Shanghai University / University of Texas Mechanical Engineering Department Academy / State University of New York / Brown University / Antioch College / Rutgers University / Iowa State University / University of Texas / Tennessee Tech University / Chemnitz University of Technology / Aalto University / Cornell University / University of Minnesota / Loughborough University of Technology / / /
IndustryTerm
Internet education / discontinuous thin metal films / cross commodity processes/products / package technology / assembly engineering / thin film transfer technology / thermal management / search team / electronics / electronic manufacturing / optoelectronics applications / package technology development / electronic devices / chemical etching / manufacturing / computing / technology working / manufacturing line / technology fairs / chip technology / interconnect products / membership services / 3D applications / radio-frequency devices / wire bonding technologies / element technologies / technology team / silicon devices / data communication systems / semiconductor devices / manufacturing technology program subcommittee / eminent media / micro-electro-mechanical systems / thermal management devices / technology development / electrical/electronic connector technology / technology strategic directions / materials processing / technology roadmap / chip interconnection technology / film technology / z10 system hardware / manufacturing technologies / disruptive technologies / electronic products / chip solder bump manufacturing line / test chips / micro-via technology / /
Organization
Global Semiconductor Alliance / Society of Plastic Engineers / EPPD Executive Committee / Iowa State University / Binghamton’s Institute for Research / University of Bordeaux / Board of IEEE CPMT Society Newsletter / Cornell University / Helsinki University of Technology / Victoria University of Wellington / American Society for Engineering Education / ASIC / Awards Committee / Tennessee Tech University / Industry Advisory Board / Manufacturing Technology Society / Components / Packaging / and Manufacturing Technology Society / Ft Walton Yacht Club / University of London / ITRS Assembly / NSF Center for Advanced Vehicle and Extreme Environment Electronics / Loughborough University of Technology / Department of Materials Science and Engineering / Pennsylvania State University / National Science Council / Electrical and Electronic Packaging Division / University of Greenwich / London / Strategic Advisory Board for NSF STC / Board of Governors / University of Wisconsin / Madison / University of Auckland / American Electroplating and Surface Finishing Society / Ft Walton Sail & Power Squadron / IEEE Education Society / Finland Chapter / Carnegie Mellon University / Surface Mount Technology Association / TMS / National Cheng Kung University / Portland State University / Oregon CPMT Chapter / IEEE CPMT Society / IEC Activities Promotion Committee of Japan / College of Engineering Senior Research / iNEMI Board / Chalmers University of Technology / Semicon West Packaging Committee / Union College / University of Texas Mechanical Engineering Department Academy of Distinguished Alumni / Society Board / ITRS / Innovative Electronics Manufacturing Research Centre / Governing Council / San Diego State University Mechanical Engineering Department / Vanderbilt University / Materials / University of Saskatchewan / American Society of Metals / Florida State College / Open University / University of Texas at Austin / University of Maryland / CPMT Society / Distinguished University / University of Missouri / University of Virginia / University of Pittsburgh / Shanghai Jiao Tong University / Ames Lab / University of Canterbury / IBM Academy of Technology / Institute of Electrical / Finance Committee / United States Power Squadron / Brown University / NSF Center for Advanced Vehicle / University of California at San Diego / Department of Mechanical Engineering / International Electrotechnical Commission / University of Illinois / Aalto University in Helsinki / Interconnections Committee for the IEEE Electronic Component Technology Conference / Publications Committee / Columbia University / IMPACT / Auburn University / Department of International Cooperation of NSC / College of Engineering Birdsong Superior Teaching / South Dakota School of Mines & Technology / Rutgers University / Manufacturing Technology Award Avram Bar-Cohen Distinguished University / Interconnection Materials Committee of TMS / National Taiwan University / Distinction / Shinshu University / Processes Subcommittee / Antioch College / General Services Administration / Chemnitz University of Technology / Precious Instrument Center / Dresden University of Technology / Society of Hispanic Engineers / Institute of Electrical and Electronics Engineers / ECTC Interconnections Program Committee / International Microelectronics and Packaging Society / IEEE Nanotechnology Council / Chinese Engineering Society / IBM East Fishkill Technical Vitality Council / Shanghai University / Institute of Micro-Nano Technology / State University of New York at Binghamton / UK Government / Association of Southeast Asian Nations / University of Maryland / College Park / Technology Committee / Strategic Award Committee / Florida Commodores Association / Materials & Processing / Taipei Chapter / Institute of Materials Research and Engineering / Invest in Finland / IEEE VLSI Package Workshop in Japan / Department of Mechanical / Institute for Senior Professionals / University of Akron / University of Texas at El Paso / Steering Committee / University of Texas Austin / University of Minnesota / /
Person
W. Ricky Lee / Paul Wesling / THOMAS G. REYNOLDS III / James E. Morris / George A. Katopis / Xuejun Fan / E. Jan Vardaman / Albert F. Puttlitz / Ricky Lee / Rajen Chanchani / Philip Garrou / S.W. Ricky Lee / George G. Harman / Michael Lebby / Ralph W. Wyndrum / Rao Tummala / STEVE J. BEZUK / Kyung W. Paik / Karl J. Puttlitz / Chin C. Lee / Region / William T. Chen / Hirofumi Nakajima / Ning-Cheng Lee / Eric Perfecto / Rao R. Tummala / H. Anthony Chan / Kitty Pearsall / Lung Lin / Jim / Li Li / C. Lee High Density Substrates / Thomas G. Reynolds III Sr. / Bahgat Sammakia / Michael Pecht / Ephraim Suhir / Douglas Hopkins / Large / Paul A. Totta / Nihal Sinnadurai / José E. Schutt-Ainé Lecturers / Badih El-Kareh / Steven Bezuk / Yutaka Tsukada / Wayne Johnson / JEAN M. TREWHELLA / Tom / T. Paul Parker / John W. Balde / Toni Mattila / Rolf Aschenbrenner Jr. / Dongkai Shangguan / Paul D. Franzon / Avram Bar-Cohen / Yong-Khim Swee / Mauro J Walker / Karl Puttlitz Sr. / Jeffrey C. Suhling / Jean Trewhella / Chris Bailey / Tony Mak / Erik Jung Circulate / Walter Trybula / R. Wayne Johnson / Johan Liu / John H. Lau / Marsha Tickman / Gilles Poupon / / /
Position
Executive Director / Financial Chair / Director / Chapter Programs KITTY PEARSALL / session chairman / secretary / author /co-author / VP of Education / author / Professor / chair of Semi Japan program committee / Managing Editor / representative / licensed Professional Engineer in the State of Texas / Director / Industry Programs / Program Director / Vice President / Conferences / consultant / Strategic Awards Director / executive chair / list Co-Editor / associate editor / position Director / President / Professor and Chair / Director / Awards Programs / Engineer / Senior Technical Advisor / technical executive / invited speaker / Regional Director / General Chair / senior member / Program Director / Chapter Programs /
Product
Reliability / Intel Best Student Paper / /
ProvinceOrState
New Jersey / Wisconsin / Illinois / Tennessee / Virginia / Alabama / Saskatchewan / Missouri / Maryland / Oregon / California / Texas / Delaware / Minnesota / New York / /
PublishedMedium
Elsevier / the IEEE Nanotechnology magazine / /
Region
Scandinavia / North West Florida / /
Technology
wire bonding technologies / electrical/electronic connector technology / PDF / Laser / ASIC / dielectric / Simulation / heat transfer / photolithography / MEMS / tantalum film technology / micro-via technology / package technology / integrated circuit / chip interconnection technology / semiconductors / optoelectronics / test chips / semiconductor / 2014 technology / 150 um pitch C4 technology / Electronic Components Technology / Ethernet / http / chip technology / Information Technology / SRAM / html / production technologies / Technology of NCKU / MEMS technologies / Technology of Indium Corporation / semiconductor devices / disk drive / thin film transfer technology / element technologies / /
Components, Packaging, and Manufacturing Technology Society Newsletter THE GLOBAL SOCIETY FOR MICROELECTRONICS SYSTEMS PACKAGING cpmt.ieee.org