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Engineering / Measuring instruments / Electronics manufacturing / Welding / Wire bonding / Thermocouple / Wire / Ball bonding / Heat transfer / Technology / Physics / Semiconductor device fabrication


Heat Affected Zone in the Wire Electrode During Electronic Flame Off in Bonding Heat Affected Zone in the Wire Electrode During
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Document Date: 2004-07-30 08:44:50


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City

Orlando / Menlo Park / Philadelphia / Albuquerque / New Orleans / Brooklyn / /

Company

IBM / Morgan Stanley Dean Witter / Ball / Polaroid / Packaging Society 209 Intl / CRC Press / Microelectronic Manufacturing / Packaging Society 203 Intl / Sandia National Laboratories / Packaging Society 207 Intl / LockheedMartin Electronics / Packaging Society 205 Intl / /

Continent

Europe / /

Country

Jordan / India / /

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Facility

Princeton University / National Institute of Standards and Technology / Applied Mechanics University of Pennsylvania Philadelphia / Columbia University / Brown University / Indian Institute of Technology / University of Mysore / University of Pennsylvania / University of California / Polytechnic Institute of Brooklyn / /

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IndustryTerm

metal wire / high temperature cement / semiconductor devices / analytical solutions / Software routines / transient energy balance / cover gas pressure / investment banking / energy / metal / software programmable steps / transient energy storage / capacitor bank / molten metal / stainless steel pensator / electrical energy / data management / unsteady energy equation subject / manufacturing operations / cumulative heat software / cover gas / software program / electrical equipment / semiconductor manufacturing industry / numerical solutions / made using a very fine metal wire / /

Organization

Columbia University / International Microelectronics And Packaging Society / National Science Foundation / Brown University / Mechanical Engineering and Applied Mechanics University of Pennsylvania Philadelphia / Princeton University / CHMT Division / the University of Pennsylvania / Outstanding Faculty / Univ. of California / Polytechnic Institute / National Institute of Standards and Technology / Indian Institute of Technology / Kharagpur / US Federal Reserve / Univ. of Pennsylvania / University of California / Los Angeles / University of Mysore / proCHMT Division / /

Person

P. S. Ayyaswamy / L. Medalla / Brian Mulada / S. Powell / M. A. Jog / S. C. Chang / Ira M. Cohen / K. M. Yu / K. G. Donovan / L. J. Huang / Srinivas S. Sripiada / Bt / Chang-Lin Tien / I. M. Cohen / S. Sripada / Leonor Medalla / B. J. Mulada / /

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Position

Advisor / Chairman Department / Chancellor / Professor of Dynamical Engineering / Model / Applications Engineer at i2 Technologies / professor of mechanical engineering / representative / /

ProgrammingLanguage

DC / /

ProvinceOrState

Louisiana / New York / New Mexico / Pennsylvania / Florida / California / /

PublishedMedium

Semiconductor International / The International Journal / The The International Journal / /

Technology

semiconductor / radiation / semiconductor devices / heat transfer / semiconductors / i2 Technologies / simulation / /

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