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Date: 2016-07-20 11:09:32Ultrasound Spectroscopy Microscopy | Nondestructive Method of TIM Bondline Measurement in Flip Chips Package H.c. Heng, V.S. Ben and K.H.Keok Advanced Micro Devices Export Sdn. Bhd. Phase III, Free Industrial Zone, Bayan Lepas, 11900 Penang, Malaysia Tel: (Add to Reading ListSource URL: www.sonoscan.comDownload Document from Source WebsiteFile Size: 2,31 MBShare Document on Facebook |