IBM / NXP Semiconductors / PROCESS DEVELOPMENT Partners / /
Continent
Europe / /
Country
Germany / France / United States / / /
Facility
LETI ENSICAEN ESIEE Paris Fraunhofer Institute Grenoble Institute of Technology IEMN IES IHP IMS MASER Engineering Micram Microelectronic / Massachusetts Institute of Technology / / /
IndustryTerm
system-on-chip / transceiver applications / measurement equipment / silicon technologies / technology back ends / communications technology industry / photonic mobile communications / bipolar transistor devices / semiconductor technologies / high manufacturing cost / nano-/microelectronic solutions / wireless networking / consumer applications / technology generations / communications equipment suppliers / silicon technology platforms / microelectronics technology platforms / active silicon devices / microelectronics communications technologies / passive devices / ultra-high-performance communications equipment / active devices / technological supply chain / silicon photonics devices / imaging / low and ultra-low-power systems / wireless communication systems / fibre optics data communications systems / satellite communications systems / on delivering nano-/microelectronic solutions / /
Organization
CATRENE Office / Advanced System Developments and User Services Agilent Technologies Alcatel Lucent Astra SES Robert Bosch Bruco Integrated Circuits CEA-LETI ENSICAEN ESIEE Paris Fraunhofer Institute Grenoble Institute of Technology IEMN IES IHP IMS MASER Engineering Micram Microelectronic / Massachusetts Institute of Technology / European Union / /
Person
Jean-Louis Carbonero / / /
Position
Salland Engineering Silicon Radar STMicroelectronics SynView Telecom Bretagne TU Berlin TU Delft TU Dresden TU Eindhoven Uni Saarland XMOD Technologies Project leader / /
ProvinceOrState
Massachusetts / /
Region
Far East / /
Technology
semiconductor / European differentiating technologies / bipolar transistor / semiconductor technologies / Salland Engineering Silicon Radar STMicroelectronics SynView Telecom Bretagne TU Berlin TU Delft TU Dresden TU Eindhoven Uni Saarland XMOD Technologies / security Energy efficiency Digital lifestyle Design technology / III-V semiconductor technologies / 55 nm CMOS technology / microelectronics communications technologies / BiCMOS technologies / BiCMOS technology / THz silicon SoC technologies / radio frequency / silicon technologies / THz system-on-chip / 55 nm BiCMOS technology / MMW SiGeC BiCMOS technology / dedicated THz SiGeC BiCMOS technology / Integrated Circuits / satellite communications / /
Project profile CT209 I From RF to MMW and THz silicon SoC technologies [RF2THZ SISOC] PROJECT CONTRIBUTES TO Communication