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Semiconductor device fabrication / Semiconductor devices / Integrated circuits / Monolithic microwave integrated circuit / Packaging / Reliability / Integrated circuit packaging / Integrated circuit / Flip chip / Gallium arsenide / Transistor


「維基夥伴獎學金」獎助生成果報告書 簡報檔 Backside Via Hole and Flip-Chip Packaging of GaAs MMICs for W-Band Applications Adviser:Prof. Edward Yi Chang
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Document Date: 2015-08-26 02:29:40


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