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Plasma processing / Technology / Physics / Etching / Plasma / CL2 / Semiconductor device fabrication / Materials science / Microtechnology


SiCl4/Cl2 plasmas: a new chemistry to etch high-k material selectively to Si-based alloys P. Bodarta, G. Cungea, C. Petit-Etiennea, M. Darnona, M. Haassa, S. Bannab, O.Jouberta and T.Lillb a CNRS-LTM,
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Document Date: 2012-05-24 09:08:30

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File Size: 682,56 KB

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City

Grenoble Cedex / Si / /

Company

Applied Materials / /

Country

France / United States / /

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IndustryTerm

energy / /

Position

Vp / /

ProgrammingLanguage

DC / /

ProvinceOrState

California / /

Technology

X-ray / /

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