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Apple iPhone 5S Camera Module 8Mpixel 1.5µm Stacked BSI CIS from Sony All in one CMOS Image Sensor: 2 levels Copper TSVs / Stacked ISP circuit with pixel array circuit / Smaller device with better sensitivity For the iP
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Document Date: 2015-08-05 12:17:40


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City

Lyon / /

Company

Mastercard / Compound Semiconductors / Lyon France Bank / AMEX / Samsung / Sony / HSBC / Power Electronics / CSC / Apple / /

Country

France / /

Currency

EUR / /

/

Event

Product Issues / /

Facility

France headquarters / /

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IndustryTerm

technology analysis / local area network / technology industrial projects / finance services / analysis technology reports / bank transfer / defective products / copyright law / search service / flip-chip / technology choices / chips / technology trends / 65nm technology node / micro manufacturing / market research / retrieval systems / online service / /

Organization

etc / European Union / /

Person

Nano / Yole Développement / David Jourdan / /

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Position

Driver / analyst / /

Product

iPhone / Apple iPhone / products / formatting / product ’ s electronic delivery format / /

Technology

LAN / MEMS / X-Ray / ISP / simulation / SRAM / two separate chips / microfluidics / Pdf / /

URL

http /

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