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Date: 2008-12-29 17:55:23Technology Capacitive Micromachined Ultrasonic Transducers Microelectromechanical systems Etching Plasma-enhanced chemical vapor deposition Chemical vapor deposition Polycrystalline silicon Strain engineering Chemical-mechanical planarization Semiconductor device fabrication Materials science Chemistry | Add to Reading ListSource URL: www.ieee-uffc.orgDownload Document from Source WebsiteFile Size: 1,69 MBShare Document on Facebook |
Imaging Bonded Wafer Defects for 3-D A practical, acoustic imaging technique is applied to bonded wafer pairs to image interface defects and wafer scratches in various materials. he range of products whose fabricationDocID: 1oWR7 - View Document | |
rdv_carnotcapteur MEMS onlyDocID: GRLB - View Document | |
Volume 22, Issue 3 Summer 2012 Vibrations Ultrasonic Industry AssociationDocID: 6LqB - View Document | |
Micromachined 35 MHz PC-MUT Array X. Jiang1, R. Liu2, X. Geng2, K. Snook1 and W. Hackenberger1,1 TRS Technologies, Inc., 2 Blatek, Inc., State College, PA. High frequency ultrasound phased array is desired for precise anDocID: 54N2 - View Document | |
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