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![]() Date: 2007-04-01 21:56:55Transducers Ultrasound Electronic design Signal processing filter Capacitive Micromachined Ultrasonic Transducers Microtechnology Microphone Impedance matching Capacitor Electromagnetism Electronic engineering Technology | Source URL: www-kyg.stanford.eduDownload Document from Source WebsiteFile Size: 1,17 MBShare Document on Facebook |
![]() | Imaging Bonded Wafer Defects for 3-D A practical, acoustic imaging technique is applied to bonded wafer pairs to image interface defects and wafer scratches in various materials. he range of products whose fabricationDocID: 1oWR7 - View Document |
![]() | rdv_carnotcapteur MEMS onlyDocID: GRLB - View Document |
![]() | Volume 22, Issue 3 Summer 2012 Vibrations Ultrasonic Industry AssociationDocID: 6LqB - View Document |
![]() | Micromachined 35 MHz PC-MUT Array X. Jiang1, R. Liu2, X. Geng2, K. Snook1 and W. Hackenberger1,1 TRS Technologies, Inc., 2 Blatek, Inc., State College, PA. High frequency ultrasound phased array is desired for precise anDocID: 54N2 - View Document |
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