<--- Back to Details
| First Page | Document Content | |
|---|---|---|
 Date: 2004-12-14 14:31:17Physics Heat conduction Convection Physical quantities Chemical engineering Thermal conduction Navier–Stokes equations Péclet number Partial differential equation Heat transfer Mechanical engineering Calculus |
| Xylem: Enhancing Vertical Thermal Conduction in 3D Processor-Memory Stacks-0.4cmDocID: 1tKKi - View Document |
| Xylem: Enhancing Vertical Thermal Conduction in 3D Processor-Memory Stacks Aditya Agrawal, Josep Torrellas and Sachin Idgunji University of Illinois at Urbana Champaign and Nvidia Corporation http://iacoma.cs.uiuc.eduDocID: 1tGlW - View Document |
| PACS №: 41.20.Gz, 84.30.Bv ∗ A.K.T. Assis and J.A. Hernandes† Instituto de F´ısica ‘Gleb Wataghin’ Universidade Estadual de Campinas – UnicampDocID: 1rpZL - View Document |
| Journal of Undergraduate Research 1, Design and Development of High Performance Vacuum Insulation Panels (VIP) with Kevlar Thread Support V. Sood University of Illinois at Chicago, Chicago, IL 60607DocID: 1rnuw - View Document |
| doi:rspaDocID: 1rjMN - View Document |