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Plating / Electrical resistance and conductance / Physics / Technology / Measurement / Shunt / electrical engineering / Wafer


Contact Resistance in Copper Plating of Wafers – Analysis and Design Criteria Yezdi Dordia, Uziel Landaub, Jayant Lakshmikanthana, Joe Stevensa, Peter Heya and Andrew Lipinc a
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City

Santa Clara / Beachwood / Seattle / /

Company

Applied Materials Inc. / L-Chem Inc. / /

Facility

Case Western Reserve University / /

IndustryTerm

computer-based modeling software / /

Organization

Case Western Reserve University / Cleveland / /

Person

Jayant Lakshmikanthana / Andrew Lipinc / Uziel Landaub / Criteria Yezdi Dordia / Peter Heya / Joe Stevensa / /

/

ProvinceOrState

Ohio / Hawaii / California / Washington / /

Technology

semiconductor / simulation / CAD / /

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