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Thin film deposition / Materials science / Semiconductor device fabrication / Copper plating / Electroplating / Plating / Adsorption / Wafer / Polyethylene glycol / Chemistry / Excipients / Coatings


Microsoft Word - 189_d_Landau.doc
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Company

IBM / L-Chem Inc. / /

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Facility

Chemical Engineering Case Western Reserve University / /

IndustryTerm

chemical system / multi-additives systems / design software / wafer plating applications / /

Organization

Department of Chemical Engineering Case Western Reserve University Cleveland / /

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Position

RT / /

Product

polyethylene glycol / /

ProvinceOrState

Ohio / /

Technology

semiconductor / /

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