![Thin film deposition / Materials science / Semiconductor device fabrication / Copper plating / Electroplating / Plating / Adsorption / Wafer / Polyethylene glycol / Chemistry / Excipients / Coatings Thin film deposition / Materials science / Semiconductor device fabrication / Copper plating / Electroplating / Plating / Adsorption / Wafer / Polyethylene glycol / Chemistry / Excipients / Coatings](https://www.pdfsearch.io/img/1974a3e22cdb156da55587f45f75cc2b.jpg)
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Company IBM / L-Chem Inc. / / / Facility Chemical Engineering Case Western Reserve University / / IndustryTerm chemical system / multi-additives systems / design software / wafer plating applications / / Organization Department of Chemical Engineering Case Western Reserve University Cleveland / / / Position RT / / Product polyethylene glycol / / ProvinceOrState Ohio / / Technology semiconductor / /
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