Back to Results
First PageMeta Content
Chemistry / Nucleate boiling / Critical heat flux / Nusselt number / Natural convection / Micro heat exchanger / Convective heat transfer / Thermal management of electronic devices and systems / Convection / Heat transfer / Chemical engineering / Mechanical engineering


Comparison of Heat Transfer Correlations for Single- and Two-Phase Microchannel Flows for Microelectronics Cooling R. R. Riehl
Add to Reading List

Document Date: 2004-07-01 12:12:15

Open Document

File Size: 303,54 KB

Share Result on Facebook

Company

Bo Boiling Number Bond Bond Number Co / F-Chart Software / B. A. Jubran S. A. / /

Country

France / United States / Brazil / /

Facility

University of São Paulo-EESC / University of São Paulo / Microelectronics Cooling R. R. Riehl Universidade de São Paulo-EESC/Clemson University / SP Brazil J. M. Ochterbeck< Clemson University / /

IndustryTerm

microelectronic devices / electronic device / typical electronic cooling applications / micro electronic devices / immersion cooling systems / given chip / electronic devices / electronic equipment / heat dissipation systems / microelectronic device / liquid immersion electronic device / /

Organization

National Science Foundation / Fulbright Foundation / University of São Paulo-EESC / Clemson University / /

Person

B. X. Wang / Wc / P. Seleghim / Jr. / R. Riehl / H. B. Ma / X. F. Peng / G. P. Peterson / X. Wang / /

Position

Author / General / G. P. / /

ProvinceOrState

South Carolina / /

Technology

dielectric / condensation / Heat Transfer / given chip / /

SocialTag