Bo Boiling Number Bond Bond Number Co / F-Chart Software / B. A. Jubran S. A. / /
Country
France / United States / Brazil / /
Facility
University of São Paulo-EESC / University of São Paulo / Microelectronics Cooling R. R. Riehl Universidade de São Paulo-EESC/Clemson University / SP Brazil J. M. Ochterbeck< Clemson University / /