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Technology / Chemistry / Deep reactive-ion etching / Microelectromechanical systems / Microfabrication / Black silicon / Etching / Wafer / Polyimide / Materials science / Semiconductor device fabrication / Microtechnology


INSTITUTE OF PHYSICS PUBLISHING JOURNAL OF MICROMECHANICS AND MICROENGINEERING J. Micromech. Microeng[removed]S91–S95
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Document Date: 2003-07-02 16:59:00


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File Size: 1,13 MB

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City

Munich / Silicon / /

Company

Clariant / Microsoft Research / HD MicroSystems / IOP Publishing Ltd / Agilent Technologies / Wyeth / Intel Corporation / Tanner Research Inc. / Oxford Instruments / /

Country

Germany / United States / /

Currency

USD / /

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Facility

University of Washington / /

IndustryTerm

metal / metal layer / blanket metal deposition / intracellular applications / planar processing / integrated devices / micro-needle devices / bare metal patch devices / neural networks / implantable tools / silicon needle silicon base release trench polyimide metal / final device / metal electrodes / interconnection devices / multi-site devices / chemical / metal films / manufacturing processes / /

Movie

PI / /

Organization

National Science Foundation / Lucile Packard Foundation / B¨ohringer Department of Electrical Engineering / University of Washington / Seattle / /

Person

Almeda Chem / Dennis Willows / /

ProvinceOrState

Washington / /

Technology

Neuroscience / MEMS / processing technology / /

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