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Technology / Chemistry / Neurophysiology / Deep reactive-ion etching / Etching / Silicon / Microelectromechanical systems / Black silicon / 100 micrometres / Microtechnology / Materials science / Semiconductor device fabrication


HIGH-ASPECT RATIO SUBMICROMETER NEEDLES FOR INTRACELLULAR APPLICATIONS C. G. J. Schabmueller, Y. Hanein, G. Holman, K. F. Böhringer University of Washington, Department of Electrical Engineering, Seattle, Washington 981
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Document Date: 2002-06-13 21:08:00

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File Size: 1,33 MB

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Madison / Munich / Seattle / /

Company

Clariant / Microsoft Research / A. O. D. Willows D. D. / T. Daniel D.D. / Agilent Technologies / Wyeth / Intel Corporation / EKC Technology Inc. / Tanner Research Inc. / Oxford Instruments / /

Country

Germany / United States / /

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Facility

K. F. Böhringer University of Washington / /

IndustryTerm

metal / interconnection device / metal layer / metal-electrolyte interface / silicon chip / neural networks / electronics / metal electrodes / silicon base release trench metal silicon needle polyimide / interconnection devices / multi-site devices / chemical / manufacturing processes / /

Organization

University of Washington / National Science Foundation / Lucile Packard Foundation / Department of Electrical Engineering / /

Person

G. Ensell / /

Position

D. J. / /

ProvinceOrState

Wisconsin / Washington / /

Technology

Neuroscience / Microelectromechanical Systems / MEMS / processing technology / silicon chip / /

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