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Design / Telecommunications engineering / Very-large-scale integration / Three-dimensional integrated circuit / International Conference on Computer-Aided Design / Design for manufacturability / International Symposium on Physical Design / Multiple patterning / Electric / Electronic engineering / Electronics / Integrated circuits


Graduate Seminar Design for Manufacturability and Reliability in Extreme Scaling and Beyond ECE Seminar Committee
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Document Date: 2015-01-31 02:10:36


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Company

IBM / /

Currency

CAD / /

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Facility

Peking University / PM Scaife Hall / University of Texas / IBM T. J. Watson Research Center / /

IndustryTerm

process technology co-optimizations / lithography technologies / disruptive manufacturing technologies / energy efficiency / /

Organization

Peking University / UCLA / Department of Electrical and Computer Engineering / University of Texas at Austin / SIGDA Outstanding New Faculty / National Science Foundation / IBM Faculty / International Technology Roadmap / ECE Department / Engineering Foundation / /

Person

Osman Yağan / David Z. Pan / Nicolas Christin / Gabriela Hug / /

Position

Author / Professor / DAC Prolific Author / Member Research Staff / ASP-DAC Frequently Cited Author / /

ProvinceOrState

Texas / /

Technology

lithography technologies / lithography / disruptive manufacturing technologies / CAD / /

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