| Document Date: 2006-02-26 22:28:26
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City Seatttle / / Country Singapore / United States / / / Facility Scale bar / University of Washington / Institute of Microelectronics / / / IndustryTerm semiconductor device / manufacturing approach / energy / / Organization University of Washington / Institute of Microelectronics / Department of Electrical Engineering / / / Position †Corresponding author / / Technology semiconductor / substrate fabrication Chip dicing Assembly Chip / diced chips / integrated circuits / in-plane orientation Pattern design Chip / /
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Preferred Presentation Mode: Oral Poster