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Digital subscriber line access multiplexer / Multiplexing / Network architecture / Ethernet frame / Internet Mix / Electronics / Internet / Digital subscriber line / Modems / Ethernet


TECHNICAL REPORT TR-273 Testing of Bonded, Multi-Pair xDSL Systems Issue: 1 Corrigendum 1 Issue Date: September 2014
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Document Date: 2014-09-24 21:28:42


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File Size: 274,03 KB

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Company

ADTRAN / The Broadband Forum / Multi-Pair xDSL Systems / CVs / /

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Event

FDA Phase / /

IndustryTerm

bonded / /

Organization

ITS / Forum / Les Brown Huawei Technologies Vice Chair Lincoln Lavoie UNH InterOperability Lab / /

Person

Lincoln Lavoie / /

Position

Editor / Issue History Issue Number Approval Date Publication Date Issue Editor / Executive / Contents EXECUTIVE / Vice Chair / /

Product

TR-273 / /

Technology

DSLAM / Ethernet / broadband network system / DSL / Gigabit Ethernet / /

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