![Chemical engineering / Heat spreader / Heat sink / Diamond / Thermal conductivity / Heat pipe / Chemical vapor deposition of diamond / Copper / Dymalloy / Chemistry / Mechanical engineering / Heat transfer Chemical engineering / Heat spreader / Heat sink / Diamond / Thermal conductivity / Heat pipe / Chemical vapor deposition of diamond / Copper / Dymalloy / Chemistry / Mechanical engineering / Heat transfer](https://www.pdfsearch.io/img/11388ced3ed4fbe0ac8d4be6df8da4c2.jpg)
| Document Date: 2009-11-04 15:58:14 Open Document File Size: 1,40 MBShare Result on Facebook
City San Francisco / Boston / / Company KINIK Company / Intel / Advanced Diamond Solution Inc. / / Country Taiwan / United States / / Currency USD / / / Facility National Taipei University of Technology / R.O.C. National Taiwan University / / / IndustryTerm metal / diamond/metal composites / large semiconductor chips / diamond/metal composite / / Organization National Taiwan University / Taipei / National Taipei University of Technology / Taipei / / Person James C. Sung / / / Product HeaThruTM / / ProvinceOrState Massachusetts / / Technology semiconductor / CPU chip / laser / heat transfer / semiconductors / simulation / large semiconductor chips / flash / CVD / / URL http /
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