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70 Technology focus: Photovoltaics GaAs/InP wafer bonding with low electrical resistance Researchers see good prospects for room-temperature wafer bonding process in multi-junction solar cell applications.
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Document Date: 2015-01-23 09:11:32

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Company

Mitsubishi / Sony Corp / APEX / /

Country

China / Japan / /

Facility

Suzhou Institute of Nano-tech / /

IndustryTerm

solar cell applications / alkali cleaning solution / 3mmx3mm chips / metal contacts / free carrier absorption / multi-junction solar cell applications / /

Organization

Suzhou Institute of Nano-tech / /

Technology

semiconductor / 3mmx3mm chips / 70 Technology / 0.5mmx0.5mm chips / /

URL

www.semiconductor-today.com / http /

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