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Electronics / Electronics manufacturing / Electrical engineering / Electronic engineering / Printed circuit board / Wire bonding / Integrated circuit / Flexible circuit / Electrical connector / Electromagnetism / Semiconductor device fabrication / Technology


Microsoft Word - LAT_TKR_elec_fabrication_embedded.doc
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Document Date: 2006-07-10 02:27:17

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File Size: 656,56 KB

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City

Pisa / Los Angeles / Ana / San Jose / /

Company

Electronics Engineers Incorporated / Epo / Agilent / Raychem / Parlex Inc. / Tyco / Teledyne Microelectronic Technologies / Pioneer Circuits Inc. / Association Connecting Electronics Industries / Dicing Services Inc. / Dynamic Details Inc. / /

Country

Italy / United States / /

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Event

Reorganization / Product Issues / /

Facility

Sonoma State University / Tarob Court / University of Pisa / Tower Electronics Module / University of California / Santa Cruz Institute / Institute of Electrical / /

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IndustryTerm

electronic media / loose chips / identical test systems / energy / metal / automated optical equipment / tracker chips / manufacturing challenges / well established technology / steel rails / metal template / high-energy astrophysics / amplifierdiscriminator chips / silicon chips / digital readout-controller chips / amplifier chips / flight hardware / chip-on-board manufacturing / metal plating / fiberglass / electronics / /

MarketIndex

case 750 / IPC / /

Organization

Space Flight Center / U.S. Department of Energy / U.S. Government / Sonoma State University / ASIC / Institute of Electrical / GLAST LAT / Santa Cruz Institute for Particle Physics / Institute of Electrical and Electronics Engineers / Stanford Linear Accelerator Center / University of California / Santa Cruz / University of Pisa / Gamma-ray Large Area Space Telescope mission / National Aeronautics and Space Administration / Tarob Court / /

Person

Carmelo Sgro / Esther Rodriguez / W. Sadrozinski / Jeff Tice / Doug Scrimes / Hartmut Sadrozinski / Jerry Clinton / Mutsumi Sugizaki / Massimo Minuti / Marcus Ziegler / Johann Cohen Tanugi / Richard Fernholz / David Rich / Roger Williams / Antonio Pontetti / Thomas Borden / Alessandro Brez / Phil Goodwin / Gloria Spandre / Brian Caplen / Kamal Prasad / Richard Gobin / Albert Nguyen / Reggie Rogers / Thomas Himel / Tim Graves / Charles Young / Hiro Tajima / Luca Baldini / Robert P. Johnson / Diane Graham / Bob Sheldon / Johann Cohen-Tanugi / David Nelson / Luca Latronico / /

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Position

General / author / major driver / authorized representative / outside consultant / quality engineer / first-named author / minimum conductor / Manager / IEEE Intellectual Property Rights Office / /

Product

connections / /

ProvinceOrState

California / /

RadioStation

Cytec FM / /

Technology

radiation / GTFE chips / amplifier chips / x-ray / two digital readout-controller chips / bad chips / rejected chips / integrated circuits / IC chip / at least one GTFE chip / 26 chips / loose chips / 297 chips / 24 64-channel amplifierdiscriminator chips / 181 chips / GTFE chip / 6 GTFE chips / ASIC / tracker chips / silicon chips / dielectric / condensation / Board Design / ENCAPSULATION All chips / /

URL

http /

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