| Document Date: 2015-02-08 22:09:51
Open Document File Size: 127,35 KBShare Result on Facebook
Company J. Wiley & Sons / Dupont / Ge / Singh & K Nagachenchaiah Semiconductor Laboratory / Hitachi / Antenna Distribution Networks / / / IndustryTerm metal / wave solution / substrate millimeter wave technology / metal layer / millimeter wave applications / bottom metal thickness / Wireless Circuits / millimeter-wave applications / circuit processing / Wireless Propagation Letters / / Person Claus Schollhorn / Raj Kumar / John Papapolymerou / Joseph Buechler / Verma / / / Position conductor / Closed-form dispersion model / / Technology radiation / microwave / Radio Frequency / present CMOS technology / Silicon High-resistivity substrate millimeter wave technology / Integrated Circuits / System-on-chip / same chip / dielectric / integrated circuit / CAD / /
SocialTag |
CAD oriented study of Polyimide interface layer on Silicon substrate for RF applications Kamaljeet Singh & K Nagachenchaiah Semiconductor Laboratory (SCL), SAS Nagar, Near Chandigarh, India