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Proceedings of the 1999 IEEE International conference on Robotics & Automation Detroit, MichiganMay 1999 Telemetric Robot Skin Mitsuhiro HAKOZAKI, Hideki OASA and Hiroyuki SHINODA
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Document Date: 2000-09-22 10:51:00

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File Size: 353,77 KB

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City

Tokyo / Detroit / /

Company

C2 (b) 1 LC / Integrated Microsystems / /

Facility

Tokyo University of Agriculture / /

IndustryTerm

energy loss / silicone rubber / sensor chips / material containing sensor chips / telemetry chips / rubber surface / circuit chip / hybrid chip / telemetry chip / sensor chip / /

Organization

Japanese MMCS committee / Japan Society for the Promotion of Science / Hiroyuki SHINODA Department of Electrical & Electronic Engineering / Wrist Force / Tokyo University of Agriculture & Technology / /

ProvinceOrState

Nova Scotia / /

Technology

telemetry chip / sensor chips / circuit chip / IC chip / Robot Tactile sensing Technology / sensing chip / frequency modulation / Using telemetry chips / material containing sensor chips / sensor chip / monolithic IC chip / hybrid chip / /

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