![Technology / Printed circuit board / Plating / Via / Electroplating / Copper / 100 micrometres / Chemical-mechanical planarization / 10 micrometres / Electronics manufacturing / Chemistry / Manufacturing Technology / Printed circuit board / Plating / Via / Electroplating / Copper / 100 micrometres / Chemical-mechanical planarization / 10 micrometres / Electronics manufacturing / Chemistry / Manufacturing](https://www.pdfsearch.io/img/78e8dd675a857047166fc1202647bedc.jpg)
| Document Date: 2011-05-27 10:45:06 Open Document File Size: 795,87 KBShare Result on Facebook
Company Stacked / Max Schlötter GmbH & Co. KG / / IndustryTerm metal / high-speed internet access / frequency applications / electronics / pad technologies / appropriate electrolyte systems / handheld devices / thermal management / compact high-performance electronic devices / manufacturing technologies / electrolyte systems / telephony / present plating equipment / / Organization High Density Interconnect Printed Circuit Board / / Person Michael Dietterle / / Position author / conductor / indisputable technology driver / / Technology high-speed internet access / digital cameras / cellular telephone / Chemical Mechanical Polishing / laser / HDI technology / pad technologies / mobile phones / IC chips / semiconductors / smart phone / digital camera / smart phones / dielectric / Smartphone / CMP / GPS / / URL www.schloetter.com / /
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