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Technology / Printed circuit board / Plating / Via / Electroplating / Copper / 100 micrometres / Chemical-mechanical planarization / 10 micrometres / Electronics manufacturing / Chemistry / Manufacturing


Article about the filling of Blind Microvias by Dr. Michael Dietterle, Dr.-Ing. Max Schlötter GmbH & Co. KG We fill the gaps ! New copper electrolyte for blind microvia filling Miniaturisation is still the determining
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Document Date: 2011-05-27 10:45:06


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File Size: 795,87 KB

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Company

Stacked / Max Schlötter GmbH & Co. KG / /

IndustryTerm

metal / high-speed internet access / frequency applications / electronics / pad technologies / appropriate electrolyte systems / handheld devices / thermal management / compact high-performance electronic devices / manufacturing technologies / electrolyte systems / telephony / present plating equipment / /

Organization

High Density Interconnect Printed Circuit Board / /

Person

Michael Dietterle / /

Position

author / conductor / indisputable technology driver / /

Technology

high-speed internet access / digital cameras / cellular telephone / Chemical Mechanical Polishing / laser / HDI technology / pad technologies / mobile phones / IC chips / semiconductors / smart phone / digital camera / smart phones / dielectric / Smartphone / CMP / GPS / /

URL

www.schloetter.com / /

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