Back to Results
First PageMeta Content
Ericsson / Semiconductor companies / Fabless semiconductor companies / Videotelephony / Software-defined radio / Ericsson Mobile Platforms / NXP Semiconductors / Semiconductor sales leaders by year / STMicroelectronics / Technology / Electronic engineering / Electronics


Document Date: 2009-01-16 04:30:29

Open Document

File Size: 131,22 KB

Share Result on Facebook

City

Bruxelles / /

Company

EN Case No COMP / JVD / Case No COMP / STM / HSPA / ERICSSON / Case COMP / JVS / FM Radio / SonyEricsson / Sony / ST-NXP Wireless / NXP Semiconductor N.V. / STMicroelectronics / Qualcomm / Intel / /

Continent

Europe / /

Country

Switzerland / Venezuela / Netherlands / Japan / Brazil / Canada / Korea / Israel / India / Mexico / Sweden / New Zealand / Sri Lanka / Belgium / United States / Vietnam / South Korea / /

Currency

EUR / /

Event

Business Partnership / M&A / /

IndustryTerm

wireless platforms / semiconductor manufacturing technology / supply wireless handsets / low cost semiconductor solutions / telecommunications equipment / wireless handset / dedicated software / hardware manufacturing / wireless communications / manufacturing requirements / 3G wireless standards / semiconductor chip / wireless handsets semiconductors / wireless handset semiconductors / wireless applications / generation wireless standards / Technology generation / industrial electronics / hardware devices / 4G technology / wireless protocol / telecommunications standards / wireless telecommunications / manufacturing / computing / voice and data / wireless infrastructure / co-processors / semiconductor devices / 3G wireless handsets / sub-systems / wireless handsets / wireless semiconductor suppliers / manufacturing process technologies / radio access technology / electricity conductors / wireless standard / wireless handset manufacturers / wireless semiconductors sector / modem technology / semiconductor manufacturer / wireless semiconductors / wafer manufacturer / wireless platform supplier / handset manufacturers / semiconductor products / semiconductor chips / platform solutions / /

Organization

European Communities COMMISSION OF THE EUROPEAN COMMUNITIES Brussels / 32008M5332 Office for Official L-2985 Luxembourg Publications / ASIC / European Union / China PRC / /

/

Position

Vice-Chairman / CEO / designer / Major / Chairman / /

Technology

2.5G / manufacturing process technologies / wireless protocol / semiconductor chip / integrated circuits / semiconductors / Third Generation technology / semiconductor chips / modem technology / GSM / 2.5G technologies / 3G / Bluetooth / semiconductor / CDMA / semiconductor devices / wireless communications / GPS / Technology generation Telecommunication technology / 4G technology / ASIC / WLAN / System-on-Chip / Radio Frequency / mature 2G/2.5G technologies / radio access technology / semiconductor manufacturing technology / integrated circuit / /

SocialTag