TSMC Solid State Lighting Ltd. / Business Development Dr. C.C. / Advanced Technologies / R&D Dr. Shang / ASML Holding N.V. / Directors Board Structure TSMC / TSMC China Company Limited. / Operations Dr. Mark / Micro Electro Mechanical Systems / Taiwan Stock Exchange / British Telecommunications / GPU / Diffused Metal Oxide Semiconductor / TSMC Global / New York Stock Exchange / Apple / TSMC Solar Ltd. / Texas Instruments Inc. / Corporate Governance Company / /
Continent
Asia / Europe / North America / /
Country
China / Japan / India / Taiwan / Belgium / United States / South Korea / /
National Development Fund / New York University / Compensation Committee / ASIC / Asia Pacific R.O.C. Securities & Futures Institute / TSMC’s OIP Alliance / Customer Trust / New Businesses / College of Nanoscale Science and Engineering / Princeton University / Accelerated Processing Unit / U.S. Securities and Exchange Commission / U.S. Green Building Council / Taipei City Government / Taiwan Asian Corporate Governance Association / Central Processing Unit / Special Board / Committee Board of Directors Chairman Vice Chairman Compensation Committee Quality / /
Person
Peter Leahy Bonfield / Yuan / Kok-Choo Chen / Thomas J. Engibous / Morris Chang / Stan Shih / Rick Tsai / Peter Bonfield / Gregory C. Chow / F.C. Tseng / Johnsee Lee / /
Position
Chairman and Chief Executive Officer / Vice President / Professor / Major Corporate Functions / Executive Vice Presidents / chairperson / representative / FHD display driver / CEO / or executive officer compensation / Chairman Acer Group / driver / R&D Vice Presidents / strong growth driver / independent consultant / consultant / leader / Senior Vice President / advisor to the Taiwan Executive Yuan / CEO Human Resources / Spokesperson Co-COO Office / Chief Executive Officer / Spokesperson Corporate finance / semiconductor sector leader / Vice Chairman of the Board / Executive / Major / Executive Vice Presidents and Co-Chief / Corporate spokesperson / Independent Director / leader in the foundry segment / Chairman / leader of the dedicated semiconductor foundry segment / controller / Chairman of the Board / Acer Group Chairman / /
Product
Open Innovation / Harman On Time Radio / Open Innovation Platform / kindle / FinFET / IPs / iPad / /
ProvinceOrState
California / New York / /
PublishedMedium
FinanceAsia / EuroMoney / /
Technology
application processors / 85nm ultra-low power technology / separate ASIC driver chip / 20nm System-on-Chip technology / non-volatile memory technologies / 20-nanometer System-on-Chip / trusted technology / 20-nanometer SoC technology / Bluetooth / test chips / semiconductor / ramping 28nm technology / 20nm technology / RF technology / Process Control / precision technology / ultra high voltage power IC technology / Meeting Information Technology Technology / ASIC / silicon germanium technologies / WLAN / smartphones / eFlash technology / radio frequency / data mining / Gigabit Ethernet / FPGA / Information Technology / 20nm process technologies / field-effect transistor / SRAM / operating system / process technology / 28-nanometer technology / backend technologies / back-end technology / purpose technology / 55nm low power RF technology / semiconductor technologies / 4.1 Technology / flash / developing 20nm technology / LAN / 16nm FinFET technology / wireless communications / lithography / solar-related technologies / System-on-Chip / Digital TV / mobile computing / process technologies / lithography technology / logic process technology / Integrated Circuit / /