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Electronic engineering / Field-programmable gate array / PCI Express / Embedded system / Xilinx / Conventional PCI / Computer hardware / Computer buses / Computing


PRESS RELEASE 3D PLUS unveils the first member of the embedded programmable modules family : FUSIO-II BUC, France, September 5th 2014 – 3D PLUS, a global leader for high reliability, high density modules solutions, tod
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Document Date: 2014-12-12 11:11:53

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File Size: 153,06 KB

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Company

3D PLUS / /

Country

France / /

Event

Product Release / /

IndustryTerm

electronics / density modules solutions / higher processing capabilities / density 3D microelectronic products / /

MusicAlbum

PLUS / /

Position

designer / /

Product

Fusio-II / /

Technology

FPGA / flash / wafer stacking WDoD™ technology / /

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