Philips Semiconductors Application note Package lead inductance considerations in high-speed applications - Ground bounce - Document - PDFSEARCH.IO

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	Philips Semiconductors Application note Package lead inductance considerations in high-speed applications Add to Reading List Document Date: 2013-07-29 12:02:05 Open Document File Size: 43,42 KB Share Result on Facebook Company L dI C(t) D 2V(t) LC / HP / / IndustryTerm integrated circuit chip / / NaturalFeature mount VCC / / Person Stephen C. Hinkle / Jeffrey A. West / / Position conductor / buffer driver / / ProgrammingLanguage DC / C / / Technology integrated circuit chip / Integrated Circuits / integrated circuit / simulation / / SocialTag Physics Inductor Inductance Capacitor Ground bounce Electrical element Surface-mount technology Electromagnetism Electronics Energy storage

Philips Semiconductors Application note Package lead inductance considerations in high-speed applicationsAdd to Reading List