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Date: 2013-05-28 16:20:41Heat transfer Passive fire protection Heat conduction Water pollution Heat sink Thermal management of electronic devices and systems Nusselt number Microfluidics Water cooling Mechanical engineering Thermodynamics Chemical engineering | CMOSAIC RTD 2009 Integrated Water Cooled 3D Electronic Chips: Experiments and ModelingAdd to Reading ListSource URL: www.nano-tera.chDownload Document from Source WebsiteFile Size: 2,67 MBShare Document on Facebook |