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Heat transfer / Passive fire protection / Heat conduction / Water pollution / Heat sink / Thermal management of electronic devices and systems / Nusselt number / Microfluidics / Water cooling / Mechanical engineering / Thermodynamics / Chemical engineering
Date: 2013-05-28 16:20:41
Heat transfer
Passive fire protection
Heat conduction
Water pollution
Heat sink
Thermal management of electronic devices and systems
Nusselt number
Microfluidics
Water cooling
Mechanical engineering
Thermodynamics
Chemical engineering

CMOSAIC RTD 2009 Integrated Water Cooled 3D Electronic Chips: Experiments and Modeling

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