| Document Date: 2012-08-08 05:51:56
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City Leoben-Hinterberg / Shanghai / Vienna / Chongqing / / Company Vienna Stock Exchange / / Continent Asia / Europe / / Country Germany / Austria / Korea / China / / / Facility Group Headquarters / Leoben plant / S plant / / / IndustryTerm manufacturing facility / electronic packaging solutions / chip embedding technology / high profile technology launch / mobile devices / technology requirements / / Organization Foundation of AT&S / Androsch Private / Dörflinger Private / Hannes Androsch Board of Management AT&S Group / European Union / / Person Andreas Gerstenmayer / Christian Vockenberger / Hannes Androsch / History / Mag / Thorsten Ziegler / Heinz Moitzi / Thomas Obendrauf / / / Position Chief Financial Officer /CFO / Chairman of the Supervisory Board / Chief Technical Officer / consortium leader / Chairman/CEO / / Technology chip embedding technology / laser / Embedded Component technology / Business intelligence / mobile devices / / URL www.ats.net / /
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AT&S Advanced Packaging – ECP® “The Leading Chip Embedding Technology”