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Intel Core / Platform Environment Control Interface / Intel / Bloomfield / Dell XPS / Computer hardware / CPU sockets / LGA


Document Date: 2009-09-29 17:15:33

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File Size: 4,87 MB

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Company

Intel Corporation / /

Country

United States / /

IndustryTerm

thermal solutions / reference design thermal solution / life sustaining applications / changes to specifications and product / Component thermal solutions / retention hardware / /

Organization

ILM Assembly / Clip Assembly / ATX Heatsink Reference Design Assembly / Center of Gravity / Assembly of ILM / Reference Design Heatsink Assembly / ILM Cover Assembly / /

/

Position

Controller / /

ProvinceOrState

Massachusetts / /

RadioStation

Core / /

Technology

12 Processor / 70 Boxed Processor / 1.2 Processor / -700 Desktop Processor / 2.1 Boxed Processor / 3-D / 4.2 Fan Speed Control Algorithm / 4.1 Boxed Processor / 60 Boxed Processor / 40 Processor / 10 Processor / 2.1 Processor / 69 Boxed Processor / 33 Processor / 4.1 Fan Speed Control Algorithm / http / 68 Baseboard Power Header Placement Relative to Processor / 67 Boxed Processor / pdf / /

URL

www.intel.com/Assets / http /

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