![Electronics / Maintenance / Prediction / Prognostics / Survival analysis / Solder / Design / Reliability / Thermal management of electronic devices and systems / Electronic design / Electronic engineering / Semiconductors Electronics / Maintenance / Prediction / Prognostics / Survival analysis / Solder / Design / Reliability / Thermal management of electronic devices and systems / Electronic design / Electronic engineering / Semiconductors](https://www.pdfsearch.io/img/301edfe78a5e5d217c31141713c8d9e0.jpg)
| Document Date: 2015-03-17 15:02:58 Open Document File Size: 480,02 KBShare Result on Facebook
Company Advanced Connectors Embedded Assembly (Passive & Active) Interposer Technologies / TechLead Corp / Technology Green Electronics Environmental Impact Analysis Green Manufacturing / IBM Corporation / / Facility IEEE Xplore Digital Library / / Organization Steering Committee / Fraunhofer Institute / Emerging Technologies Advanced Connectors Embedded Assembly / / Person Charles E. Bauer / David Raby / Jing Zhang / / Position WB / / ProvinceOrState Hawaii / / Technology Thermal Management Printed Electronics Wearable Electronics Structural Electronics Sensor Technology / Operations Management Technology / MEMS / OLED / / URL www.smta.org/panpac / /
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