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INTRODUCTION FROM THE 65TH ECTC PROGRAM CHAIR HENNING BRAUNISCH The 65th Electronic Components and Technology Conference (ECTC) Sheraton San Diego Hotel & Marina, San Diego, California, USA • May[removed], 2015 On beha
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Document Date: 2015-03-25 11:11:27


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File Size: 2,80 MB

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City

San Diego / /

Country

United States / /

Currency

USD / /

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Facility

Lobby Level / Technology Jean Trewhella GLOBALFOUNDRIES Shogo Ura Kyoto Institute of Technology Ping Zhou LDX Optronics / Virginia Commonwealth University / Tentzeris Georgia Institute of Technology Sridhar Canumalla Microsoft Corporation Tom Poulin Aerie Engineering Frank Theunis Qualcomm Technologies / Muhannad Bakir Georgia Institute of Technology Omar Bchir Qualcomm Technologies / Inc. Tony Mak Wentworth Institute of Technology John Hunt ASE / Portland State University / P. Wong Georgia Institute / West Towers / Stanford University / University of Illinois / Hotel Accommodations Rooms / Hotel Information / En-Xiao Liu Institute of High Performance Computing / Lakshmi N. Ramanathan Microsoft Corporation Ephraim Suhir University of California / Luca Roselli University of Perugia Mali Mahalingam Freescale Semiconductor / Packard Company Jintang Shang Southeast University Nancy Stoffel GE Global Research Vivek Subramanian University of California Klaus-Jürgen Wolter Technische Universität / Inc. Bruce Kim City University of New York Pradeep Lall Auburn University Sheng Liu Huazhong University of Science / Tampere University / A*STAR Rao Bonda Amkor Technology Erdogan Madenci University of Arizona Mark Eblen Kyocera America / Inc. Frank Wei Disco / Ltd. Suresh K. Sitaraman Georgia Institute of Technology G. Q. / Georgia Institute of Technology Course Objectives / University of California / University of Maryland Course Objectives / Zhang Delft University of Technology / Hotel Reservations Attendees / Bradley University / Intel Corporation Joana Maria IBM Corporation Goran Matijasevic University of California / Georgia Institute of Technology / Bayview Foyer / Jai Agrawal Purdue University Vasudeva P. Atluri Renavitas Technologies Mark Bachman University of California / Mayo Clinic / Sheraton San Diego Hotel / San Diego International Airport / Markondeya Raj Georgia Institute of Technology Choon Heung Lee Amkor Technology / Inc. Chin C. Lee University of California / /

IndustryTerm

technology innovation / ultrasmall systems / interconnect technologies / flip chip / important products / prognostic health management / wireless chips / package technologies / electronic technology / flip chip technology / power electronic systems / underfill assembly technologies / healthcare monitoring / electronic systems / food / energy / package technology development / healthcare industry / nanoelectronic devices / nanoscale device / energy efficiency / manufacturing / computing / healthcare paradigm shifts / Online registration / battery technology / medical device applications / wearable systems / supply chain / authorized site / job search / radar systems / technology innovations / performance computing efficiency / hightech devices / analytical tools / healthcare cost reduction / wirebond chip / Smart devices / direct chip / thermal management / free shuttle transportation / personalized healthcare / flip chip products / technology paradigms / smartphone technology / wireless technologies / 5B transistor chip / electronics / system engineering / wrist products / chipon-chip / e-blasts / system scaling technologies / pillar flip chip technologies / semiconductor products / namely applied liquid and phase-change technologies / /

MarketIndex

ECTC / /

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Product

Microsoft Corporation Portable Audio Device / /

ProvinceOrState

California / Georgia / Texas / Illinois / /

Technology

FLIP CHIP TECHNOLOGIES / Substrate Technologies / wirebond chip / system scaling technologies / TSV technologies / smartphone technology / heat transfer / Consultant Wei Koh Pacrim Technology / mobile devices / MEMS / electronic technology / 100 Technology / Optoelectronics / wireless technologies / cooling technologies / 3G / package technologies / semiconductor / namely applied liquid and phase-change technologies / Smartphone / Cu Pillar Flip Chip / flip chip technology / Life-science technology / underfill assembly technologies / cellular telephone / Laser / Package Technology / Bio-medical technology / smartphones / dielectric / Cu pillar flip chip technologies / battery technology / wireless chips / Simulation / 29 2015 Technology / 5B transistor chip / /

URL

www.ectc.net / /

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