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TSMC BUSINESS OVERVIEW 2012 TSMC VISION & CORE VALUES TSMC’s Vision Our vision is to be the most advanced and largest technology and foundry services provider to fabless companies and IDMs, and in partnership with th
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Document Date: 2013-07-16 01:17:01

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City

Hsinchu / Albany / San Jose / /

Company

TSMC Solid State Lighting Ltd. / Business Development Dr. C.C. / Advanced Technologies / R&D Dr. Shang / ASML Holding N.V. / Directors Board Structure TSMC / TSMC China Company Limited. / Operations Dr. Mark / Micro Electro Mechanical Systems / Taiwan Stock Exchange / British Telecommunications / GPU / Diffused Metal Oxide Semiconductor / TSMC Global / New York Stock Exchange / Apple / TSMC Solar Ltd. / Texas Instruments Inc. / Corporate Governance Company / /

Continent

Asia / Europe / North America / /

Country

China / Japan / India / Taiwan / Belgium / United States / South Korea / /

Currency

USD / EUR / TWD / /

EntertainmentAwardEvent

Corporate Governance Asia 8th Recognition Awards / 2012 Corporate Governance Awards / /

Event

Funding / Company Expansion / General or Shareholder Meeting / Employment Change / Earnings Announcement / Dividend Issuance / Business Partnership / Company Listing Change / M&A / /

Facility

Princeton University / New York University / Total foundry / College of Nanoscale Science / /

IndustryTerm

manufacturing facility / integrated semiconductor foundry services / computer-integrated manufacturing systems / quality design services / lithographic technology / interconnect technologies / wireless communications systems / mainstream technology research / wide-ranging needs / technology definition / electronics devices / precision technology / performance-driven products / high product mix semiconductor manufacturing environment / downstream chain / Wireless Local Area Network / semiconductor technologies / electronic applications / manufacturing sub-segment / 28nm technology / mobile computing products / trusted technology / consumer electronics products / silicon germanium technologies / backend technologies / manufacturing needs / intellectual property management / consumer electronics / materials handling systems / 40nm general purpose technology / complicated software / green manufacturing / manufacturing strategy / supply chain / industrial related products / performance-driven mixed-signal applications / 450mm operation / automotive and industrial equipment / digital consumer applications / business law / backend services / design technology infrastructure / process technology / long and complex supply chain / eFlash technology / technology / physical security management / design services / 20nm technology / owned subsidiaries / process technology advancement / impacted consumer electronics sales / process technologies / flash controller applications / manufacturing level / handheld applications / products / end products / back-end technology / technology development / manufacturing facilities / risk management / finance / manufacturing customers / state lighting devices / manufacturing processes / mobile computing / fab manufacturing management system / lithography tools / quality management / lithography technology / semiconductor supply chain / microcontroller applications / logic process technology / semiconductor manufacturing / account management / manufacturing infrastructure / electronics industry / information technology / manufacturing / computing / turn-key solution / investment management / mobile computing applications / technology leadership / Real-time equipment performance / needed design infrastructure / industrial and other electronics markets / market semiconductor products / data mining / resources management / wireless connectivity applications / tablet products / mobile computing devices / manufacturing efficiency / upstream supplier / 85nm ultra-low power technology / internal auditors / technology nodes / reliability management / technology challenge / driver chip / smartcard applications / technology frontier / 20nm process technologies / test chips / achieved technology leadership / technology node / public relations / manufacturing capability / non-volatile memory technologies / accelerometer applications / health management / solar-related technologies / manufacturing excellence / speed networking applications / /

MarketIndex

Dow Jones Sustainability / /

MusicAlbum

Asia / /

OperatingSystem

Microsoft Windows / /

Organization

National Development Fund / New York University / Compensation Committee / ASIC / Asia Pacific R.O.C. Securities & Futures Institute / TSMC’s OIP Alliance / Customer Trust / New Businesses / College of Nanoscale Science and Engineering / Princeton University / Accelerated Processing Unit / U.S. Securities and Exchange Commission / U.S. Green Building Council / Taipei City Government / Taiwan Asian Corporate Governance Association / Central Processing Unit / Special Board / Committee Board of Directors Chairman Vice Chairman Compensation Committee Quality / /

Person

Peter Leahy Bonfield / Yuan / Kok-Choo Chen / Thomas J. Engibous / Morris Chang / Stan Shih / Rick Tsai / Peter Bonfield / Gregory C. Chow / F.C. Tseng / Johnsee Lee / /

Position

Chairman and Chief Executive Officer / Vice President / Professor / Major Corporate Functions / Executive Vice Presidents / chairperson / representative / FHD display driver / CEO / or executive officer compensation / Chairman Acer Group / driver / R&D Vice Presidents / strong growth driver / independent consultant / consultant / leader / Senior Vice President / advisor to the Taiwan Executive Yuan / CEO Human Resources / Spokesperson Co-COO Office / Chief Executive Officer / Spokesperson Corporate finance / semiconductor sector leader / Vice Chairman of the Board / Executive / Major / Executive Vice Presidents and Co-Chief / Corporate spokesperson / Independent Director / leader in the foundry segment / Chairman / leader of the dedicated semiconductor foundry segment / controller / Chairman of the Board / Acer Group Chairman / /

Product

Open Innovation / Harman On Time Radio / Open Innovation Platform / kindle / FinFET / IPs / iPad / /

ProvinceOrState

California / New York / /

PublishedMedium

FinanceAsia / EuroMoney / /

Technology

application processors / 85nm ultra-low power technology / separate ASIC driver chip / 20nm System-on-Chip technology / non-volatile memory technologies / 20-nanometer System-on-Chip / trusted technology / 20-nanometer SoC technology / Bluetooth / test chips / semiconductor / ramping 28nm technology / 20nm technology / RF technology / Process Control / precision technology / ultra high voltage power IC technology / Meeting Information Technology Technology / ASIC / silicon germanium technologies / WLAN / smartphones / eFlash technology / radio frequency / data mining / Gigabit Ethernet / FPGA / Information Technology / 20nm process technologies / field-effect transistor / SRAM / operating system / process technology / 28-nanometer technology / backend technologies / back-end technology / purpose technology / 55nm low power RF technology / semiconductor technologies / 4.1 Technology / flash / developing 20nm technology / LAN / 16nm FinFET technology / wireless communications / lithography / solar-related technologies / System-on-Chip / Digital TV / mobile computing / process technologies / lithography technology / logic process technology / Integrated Circuit / /

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