Piscataway / Bucharest / Las Vegas / Berlin / New York / /
Company
TC-GEMP - Green Electronics Manufacturing / Electronics Engineers Inc. / IBM Corporation / European Activities / AEs / IEEE CPMT Society Newsletter 1 CPMT Officers / Thin Polymer Films / Thomson / Manufacturing Technology / Endicott Interconnect Technologies / Fujitsu Interconnect Technologies / Electronics Packaging Manufacturing / Jan Vardaman of TechSearch International / Las Vegas NV / Distinguished Lecturers / Sandia Labs / TechSearch International / /
Continent
Asia / Europe / /
Country
Malaysia / Hungary / Germany / Romania / United States / /
Currency
USD / / /
Event
Person Communication and Meetings / /
Facility
Stanford University / University of Illinois / Budapest University of Technology / Germany’s Fraunhofer Institute / Electronic Packaging Education Training University / Herbert Reichl Technical University of Berlin / Purdue University / University of California / Technical University of Berlin / Prize Winner University of Technology / Politehnica University of Bucharest / Technical University of Cluj-Napoca / University of Timis¸oara / Institute of Electrical / University of Hawaii / University of Bucharest / / /
IndustryTerm
online content / input device / thin metal film / electromagnetic software / Online publication / Web Account / wire bonding technologies / technology transfer / software providers / semiconductor devices / electronic packaging technology / metal patterns / micro-electro-mechanical systems / Web Account username / Web Account Needed / process technology / optoelectronic packaging technology development / electronics / conformal applications / process technologies / manufacturing regions / technology development / electrical/electronic connector technology / post-processing output files / digital systems / Wireless Applications / 3D technology / manufacturing / film technology / radio frequency identification device / flip chip interconnection technology / manufacturing technologies / metal layer / micro-via technology / /
MusicGroup
Ph.D. / /
Organization
Marsha Tickman IEEE CPMT Executive Office / Univ of Alabama / Technical Committee / CPMT Society / Student Branch Chapter / ITRS Assemblies and Packaging Technology Committee / Manufacturing Technology Society / Components / Packaging / and Manufacturing Technology Society / Germany’s Fraunhofer Institute for Reliability and Microintegration / University of Bucharest / Hong Kong Univ of Science & Technology / Institute of Electrical / Fraunhofer Institute for Reliability and Microintegration / SUNY / Organizing Committee / Purdue University / Package Assembly / University of Illinois / PDC Committee / University of Hawaii / Technical University of Berlin / Board of Governors / Hu&Ro Joint Chapter / Electronic Packaging Education Training University / CPMT Publications Committee / IEEE Technical Activities Board / Cpmt Society Board / University of California / Irvine / Technical University of Cluj / University of Timis¸oara / TIE Steering Committee / Univ. of Maryland / CPMT Board of Governors / Conference Advisory Committee / Institute of Electrical and Electronics Engineers / 3rd Prize Winner University of Technology and Economics / Budapest / IEEE CPMT Society / University of Maryland For / Executive Committee / Industrial Advisory Committee / IC / Stanford University / Budapest University of Technology and Economics / /
Person
Kevin Stumpfa / Paul A. Totta / Nihal Sinnadurai / Paul Wesling / Daniela Staiculescu / Badih El-Kareh / James E. Morris / George A. Katopis / Yutaka Tsukada / Jeng-Hau Lin / Xuejun Fan / E. Jan Vardaman / Toshihide Uematsu / Takashi Akazawa / Michihiro Kawashita / Albert F. Puttlitz / Wei Huang / Thomas Blaser / Wei-Da Guo / Louis Ridley / Wayne Johnson / Herbert Reichl Fraunhofer / Masaki Nakanishi / George G. Harman / Takahiro Naito / Michael Lebby / Reichl Receives / Mark Poliks / Christopher Yoshizaki / Yoshitaka Fukuoka / Joseph Longhi / Steve J. Bezuk / Rao Bonda / Kyung W. Paik / Puttachat Khuntontong / Karl J. Puttlitz / Marius Rangu / Norihisa Toma / Allen Earman / Oscar MahinFallah / T. Paul Parker / Lara J. Martin / William T. Chen / John W. Balde / Dongkai Shangguan / Joshua Miyamoto / Wolfgang Sauter / Ning-Cheng Lee / S. W. Ricky Lee / Rolf Aschenbrenner / Eric Perfecto / Rao R. Tummala / Malcolm S Menor / Torsten Wipiejewski / Dan Pitic / Walter J. Trybula / Frank Shi / Werner Karl Schomburg / Chuichi Miyazaki / H. Anthony Chan / Kitty Pearsall / Paul D. Franzon / Avram Bar-Cohen / Yong-Khim Swee / Herbert Reichl / Jorma Kalevi Kivilahti / Karl Puttlitz Sr. / Takafumi Kikuchi / Shane Sunada / Kenji Hanada / Michael D. Hill / Chien-Min Lin / Kishio Yokouchi / Jean Trewhella / Philip E. Garrou / Ed Aoki / Lisa Renzi / Bob Miller / Bahgat Sammakia / Norocel Codreanu / Cheng Lee / Mitchell LaPuente / Jan Vardaman / David McCann / Michael Pecht / Herbert Reichl Receives / C.P. Wong / R. Wayne Johnson / Yasuhiro Yoshimura / Paul Svasta / Ephraim Suhir / Johan Liu / John H. Lau / Charles Lee / N. Rao Bonda Jie Xue / Marsha Tickman / R. Wayne Johnson Kitty Pearsall Thomas / Jie Xue / Koneru Ramakrishna / Ralph W. Wyndrum / Michael Toepper / Eric Jung / Tony Mak / Ricky S.W. Lee / Craig A. Gaw / Chris Bailey / Nils F. Nissen / José E. Schutt-Ainé / Cian O Mathuna / John E. Proulx / Patrick Thompson / Douglas Hopkins / Bruce Kim / Martin Goetz / Jerry Witter / / /
Position
Advisor / Executive Director / Vice President / Bosavi Team leader / Editor in Chief / author / Contractor / Vice-chair / professor / representative / Program Director / Team leader / founding director / Editor-in-Chief / reliability degradation model / packaging engineer / Young Engineer / President / PCB designer / reliability degradation model for thermal interface materials / advocate / Co-chair Steering Committee / Press Officer / VP of Publications / Strategic Program Director / VP / team member / Director / Chair / Co-Editor-in-Chief / leader / william.chen@aseus.com Program Director / Distinguished Lecturer / /
Product
Reviewers / /
ProvinceOrState
California / New Jersey / Hawaii / New York / Maryland / /
PublishedMedium
the TAB review / /
SportsLeague
Stanford University / /
Technology
flip chip interconnection technology / optoelectronics / wire bonding technologies / electrical/electronic connector technology / semiconductor / electronic packaging technology / dielectric / radio frequency / Simulation / mobile phones / process technology / 3D technology / MEMS / tantalum film technology / micro-via technology / SDRAM chip / CAD / semiconductor devices / Packaging Technology / process technologies / /
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