![Electronic engineering / Electrical engineering / Electromagnetism / Semiconductor device fabrication / Packaging / Electronics manufacturing / Ball grid array / Surface-mount technology / Solder / Reflow soldering / Integrated circuit packaging / Reliability Electronic engineering / Electrical engineering / Electromagnetism / Semiconductor device fabrication / Packaging / Electronics manufacturing / Ball grid array / Surface-mount technology / Solder / Reflow soldering / Integrated circuit packaging / Reliability](https://www.pdfsearch.io/img/98a46a3626c5bbbd0d439f23bff282ce.jpg) Date: 2016-07-20 11:09:32Electronic engineering Electrical engineering Electromagnetism Semiconductor device fabrication Packaging Electronics manufacturing Ball grid array Surface-mount technology Solder Reflow soldering Integrated circuit packaging Reliability | | CSP and micro-BGA Process and Damage Assessment with Acoustic Micro Imaging (AMI) Steven R. Martell and J.E. Semmens SONOSCAN IncE. Pratt Blvd. Elk Grove Village, IL 60007Add to Reading ListSource URL: www.sonoscan.comDownload Document from Source Website File Size: 407,57 KBShare Document on Facebook
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