Microperipheral Technologies / Multifunctional On-Top Technologies / Multi-Functional On-Top Technologies / Board Interconnection Technologies / Fraunhofer Microelectronics Group / EMC / Modern Packaging Technologies / Fraunhofer IZM Technologies / Substrate Integration Technologies / Chip Interconnection Technologies / Integrierte Schaltungen IIS Am Wolfsmantel 33 / W+G GmbH / Microperipheric Technologies / Robert Bosch GmbH / Technik GmbH / Universität Rostock Fraunhofer IZM / Integrated Systems / Electronics Condition Monitoring Laboratory / Device Technology IISB / Polytronic Systems / CWM GmbH / Würth Elektronik KG / Wafer Level Integration Technologies / Active Driver Assistance Systems / /
Continent
Europe / Asia / /
Country
Germany / United States / /
Currency
EUR / / /
Event
Business Partnership / Employment Change / Environmental Issue / /
Facility
Tongji University Shanghai Industrial Technology Research Institute / Korea Advanced Institute of Science / Industrial Research Institute of Malaysia / Sustainability Fraunhofer Institute / University of Tokyo Led / Universität Bonn Georgia Institute / Berlin Fraunhofer Institute / /
IndustryTerm
joint focal research groups / microelectronics technologies / communication technology / microsystem technology / access to its machines and equipment / radar-based systems / connection technology / customers and partners with some solutions / technology development / function tests / individual chips / carrier substrate / electronic systems / value chain / manufacturing processes / technology park / manufacturing process / collision site / metal / technology areas / data processing / suitable hardware / energy requirements / energy management / interconnection technology / manufacturing / system integration technologies / microwave technologies / silicon technologies / chip-in-polymer technology / manufacturing questions / software technologies / manufacturing phase / higher requirements active safety systems / interconnection technologies / organizational infrastructure / technological system solutions / industrial manufacturing processes / miniaturized systems / electronics / multilayer technologies / driver assistance systems / public relations / ip-chip technology / /
Organization
Technology CEA Leti Humboldt Universität / Universität Bonn Georgia Institute / Umbrella Organization / Technische Universität Berlin / Humboldt-Universität / Berlin senate / University of Tokyo Led / Federal Ministry of Education / then German Federal Ministry / Sustainability Fraunhofer Institute for Reliability / German Federal Ministry for Research and Technology / Fraunhofer-Institut / Fraunhofer-Gesellschaft / Standard and Industrial Research Institute of Malaysia / Human Centric Communication Center / Universität Erlangen-Nürnberg / Berlin Fraunhofer Institute for Reliability / Korea Advanced Institute of Science and Technology / Institute for Mechanics / Qualification and Test Center / Academy of the Sciences / Universität Stuttgart / Berlin Technische Universität Dresden Technische Universität Chemnitz Technische Universität Bergakademie Freiberg Universität Heidelberg BTU Cottbus / Thanks to Universität / Georgia Institute of Technology / Tongji University Shanghai Industrial Technology Research Institute Taiwan / /
Person
Rolf Aschenbrenner / Wolisz / Christian Lüdemann / Martin SchneiderRamelow / Kutzler / Herbert Reichl / Joseph von Fraunhofer / Ralph Stömmer / Karlheinz Bock / Zöllner / DIN EM / Scheel / Geßner / Heinz Gerhäuser / Klaus Halser / Joachim Pelka / Karl-Friedrich Becker / Hubert Lakner / Olaf Bochow-Neß / / /
Position
Professor for Polytronic Microsystems / Head of central office / Chairman of the Group / Professor / representative / Deputy chairman / driver / young scientist / researcher / inventor and entrepreneur / long-standing head of the department / Professor of Polytronic Microsystems / /
Fraunhofer IZM Annual Report[removed] Packaging | Quality | Reliability | Sustainability Fraunhofer Institute for Reliability and Microintegration IZM